TZA3001U PHILIPS [NXP Semiconductors], TZA3001U Datasheet - Page 17

• Manufacturer Part Number: TZA3001U
• Description: SDH/SONET STM4/OC12 laser drivers
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
Table 1 Physical characteristics of bare die
1999 Aug 24
handbook, full pagewidth
Glass passivation
Bonding pad dimension
Metallization
Thickness
Size
Backing
Attache temperature
Attache time
SDH/SONET STM4/OC12 laser drivers
(1) Typical value.
PARAMETER
ALARM
V CC(R)
V CC(R)
DINQ
GND
GND
GND
ENL
ALS
DIN
2.1 m PSG (PhosphoSilicate Glass) on top of 0.7 m silicon nitride
minimum dimension of exposed metallization is 90
1.2 m AlCu (1% Cu)
380 m nominal
2.000
silicon; electrically connected to GND potential through substrate contacts
<430 C; recommended die attache is glue
<15 s
35
36
37
38
39
40
31
32
33
34
30
Fig.8 Bonding pad locations of TZA3001U.
1
2.000 mm (4.000 mm
29
2
28
3
27
4
x
TZA3001U
26
5
2 mm
0
y
0
17
25
6
(1)
2
)
24
7
23
8
VALUE
22
9
TZA3001AHL; TZA3001BHL;
21
10
20
19
18
17
16
15
14
13
12
11
BIAS
LA
LAQ
V CC(B)
V CC(B)
GND
GND
GND
GND
GND
90 m (pad size = 100
MGL192
2 mm
(1)
Preliminary specification
TZA3001U
100 m)