STR752FR1H7 STMICROELECTRONICS [STMicroelectronics], STR752FR1H7 Datasheet - Page 76

• Manufacturer Part Number: STR752FR1H7
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package characteristics
6
6.1
Figure 45. 64-pin low profile quad flat package (10x10)
76/84
PIN 1
IDENTIFICATION
M x 45°
Package characteristics
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at www.st.com.
Package mechanical data
D1
D3
D
E3
L1
E1
E
L
seating plane
K
0.10mm
.004
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
B
e
A1
A
A2
c
1.
Dim.
A1
A2
D1
E1
L1
A
C
D
K
N
b
E
e
L
Values in inches are converted from mm
and rounded to 4 decimal digits.
0.05
1.35 1.40 1.45 0.0531 0.0551 0.0571
0.17 0.22 0.27 0.0067 0.0087 0.0106
0.09
0.45 0.60 0.75 0.0177 0.0236 0.0295
Min
0°
12.00
10.00
12.00
10.00
0.50
1.00
mm
Typ
3.5°
Number of pins
Max
1.60
0.15 0.0020
0.20 0.0035
7°
64
Min
0°
inches
0.4724
0.3937
0.4724
0.3937
0.0197
0.0394
Typ
3.5°
(1)
0.0630
0.0059
0.0079
Max
7°