ISPPAC30-01SI LATTICE [Lattice Semiconductor], ISPPAC30-01SI Datasheet

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ISPPAC30-01SI

Manufacturer Part Number
ISPPAC30-01SI
Description
In-System Programmable Analog Circuit
Manufacturer
LATTICE [Lattice Semiconductor]
Datasheet
October 2001
Features
www.latticesemi.com
Flexible Interface and Programming Control
Four Input Instrumentation Amplifiers (IA’s)
Two Configurable Rail-to-Rail Output Amps
Two, 4-Quadrant 8-Bit Multiplying DAC’s
Analog Input/Summation Routing Pools
Other Product Features
Applications
• Full configuration capability, SPI or JTAG modes
• Unlimited device updates using SRAM register
• E
• Real-time microcontroller configuration/control
• High impedance: differential or single-ended
• 0V to 2.8V with programmable gains (±1 to ±10)
• Dual multiplexers (pin or serial port controlled)
• Connects easily to existing system circuits
• Single-ended, 0V to 5V output swing
• Gain bandwidth product >15MHz
• Amplifier, filter, integrator or comparator modes
• 7 filter frequencies (50kHz to 600kHz)
• Full bandwidth when used as a multiplier
• Precision gain (<0.01 steps) with signal as input
• Precision offset (in 7 ranges) using internal Vref
• Routing of all I/O to any IA or MDAC
• Any IA/MDAC summed to either output amplifier
• Circuits with and without feedback possible
• Routable to maintain pin location relationships
• Single supply (+5V) operation
• Precision voltage reference output (2.5V)
• Power-down for µ Watt power consumption
• Auto-calibration of internal offsets
• Available in 28-pin PDIP or 24-pin SOIC
• Reconfigurable or adaptive signal conditioning
• Analog front end for most A/D converters
• Programmable analog signal control loops
• Precision programmable gain amplifiers
Vin1
Vin2
Vin3
2
CMOS
ispPAC30
®
for non-volatile configuration storage
µController
12-Bit
Dual
ADC
1
Functional Block Diagram
Description
The ispPAC
System Programmable (ISP™) analog integrated cir-
cuits. It is digitally configured via SRAM and utilizes
E
ration. The flexibility of ISP enables programming, verifi-
cation and unlimited reconfiguration, directly on the
printed circuit board.
The ispPAC30 is a complete front end solution for data
acquisition applications using 10 to 12-bit ADC's. It pro-
vides multiple single-ended or differential signal inputs,
multiplexing, precision gain, offset adjustment, filtering,
and comparison functionality. It also has complete
routability of inputs or outputs to any input cell and then
from any input cell to either summing node of the two
output amplifiers. Designers configure the ispPAC30
and verify its performance using PAC-Designer
easy to use, Microsoft Windows
ment tool. Device programming is supported using PC
parallel port I/O operations.
VREFOUT
2
CMOS memory for non-volatile storage of its configu-
SCOM
OUT1
OUT2
IN1+
IN1-
IN2+
IN2-
IN3+
IN3-
IN4+
IN4-
In-System Programmable Analog Circuit
13
14
15
16
17
18
19
20
21
22
23
24
®
30 is a member of the Lattice family of In-
& Configuration
Interface Logic
JTAG/SPI
ispPAC30 24-Pin SOIC
Memory
MDAC
MDAC
IA
IA
Vref1
Vref2
IA
IA
ispPAC30
Auto-Calibration
2.5V Reference
®
Preliminary Data Sheet
OA
OA
Compare
Integrate
Compare
compatible develop-
Integrate
Amplify
Amplify
Filter
Filter
12
11
10
9
8
7
6
5
4
3
2
1
pac30_01
VS
ENSPI
TMS
TDO
TDI
TCK
CS
MSEL1
MSEL2
CAL
PD
GND
®
, an

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ISPPAC30-01SI Summary of contents

Page 1

... The flexibility of ISP enables programming, verifi- cation and unlimited reconfiguration, directly on the printed circuit board. The ispPAC30 is a complete front end solution for data acquisition applications using 10 to 12-bit ADC's. It pro- vides multiple single-ended or differential signal inputs, multiplexing, precision gain, offset adjustment, filtering, and comparison functionality ...

Page 2

... VREF Reference Output Range OUT IREF Reference Output Current OUT Reference Output Drift Reference Output Noise Power Supply Rejection Comparator Mode Performance Comparator Switching Time Overload Recovery Time ispPAC30 Preliminary Data Sheet Condition Applied to either IN+ IN IN+ IN- G -40° ...

Page 3

... All gains, minimum feedback capacitor All gains All gains 4V output step, low to high 4V output step, high to low Ω 10kHz L IN Deviation from calculated -3db point -40 ° +85 °C 3 ispPAC30 Preliminary Data Sheet Min. Typ. Max. 7+sign 0.25 0 1.25 1 ...

Page 4

... Computed 3db corner frequencies are 619kHz, 401kHz, 250kHz, 169kHz, 114kHz, 74kHz and 49kHz. Actual values found in PAC- Designer software. 8. Logic inputs will exhibit positive current configured with a pull-down and negative current with a pull-up. 9. Configured so all internal circuitry is powered on. ispPAC30 Preliminary Data Sheet Condition No pull-up/pull-down With pull-up/pull-down (8) ...

Page 5

... Auto-Calibrate PD Power Down VS Supply Voltage GND Ground SCOM Signal Common NC No Connects 5 ispPAC30 Preliminary Data Sheet Description Differential input pins, with two pins per input (e.g., IN2+ and IN2-). Each are components where differential IN+ IN- Multiplexer logic input pin. Selects either of two analog channels to IA1 (instrument amplifi ...

Page 6

... OA 6 MSEL1 SCOM 20 Filter Amplify 5 NC IN3+ 21 Integrate Compare 4 MSEL2 IN3 CAL IN4+ 23 Auto-Calibration 2 PD IN4- 24 2.5V Reference 1 GND 6 ispPAC30 Preliminary Data Sheet 12 VS Vref1 11 ENSPI TMS Filter IA Amplify 9 TDO Integrate Compare MDAC 8 TDI 7 TCK MDAC MSEL1 Filter ...

Page 7

... Lattice Semiconductor Part Number Description Device Family Device Number ispPAC30 Ordering Information ispPAC30-01PI ispPAC30-01SI Package Options ispPAC30 – Part Number 28-Pin PDIP 24-Pin SOIC 7 ispPAC30 Preliminary Data Sheet Grade Blank = Commercial I = Industrial Package P = PDIP S = SOIC Performance Grade 01 = Standard Package 28-pin PDIP ...

Page 8

... TDO Delay Float to Valid tdov TDO Delay Clock to Valid tdoxz TDO Delay Valid to Float calmin Minimum Calibration Pulse TCK TMS TDI TDO CAL ispPAC30 Preliminary Data Sheet Conditions — — — — — — — — — — — tckmin ...

Page 9

... TCK tencss ENSPI ttcsfs CS TDI TDO tdozx Parameter tckh tckl tckmin tcsfts tdis tdih LSB tdov LSB 9 ispPAC30 Preliminary Data Sheet Min Typ Max 80ns 40ns 40ns 5ns 8ns 10ns 10ns 10ns 8ns 25ns 10ns 60ns 60ns 60ns 145ns 30ns … ...

Page 10

... Executed in Run-Test/Idle Executed in Run-Test/Idle tpwp, tpwe tmss (PRGCFG/CLRALL executed in Run-Test/Idle state) Executed on rising edge of CAL (Note: CAL internally initiated at device turn-on.) tcalmin V OUT = 0V tpwcal1, tpwcal2 10 ispPAC30 Preliminary Data Sheet Min Typ 80ms 80ms tmss Conditions Min Typ 140ms — 30ns 50ms ...

Page 11

... Offset Voltage ( Wafer Lots PDIP Pkg 25 +25°C For All Gains, 20 Output Referred +1 Offset (mV) 11 ispPAC30 Preliminary Data Sheet PSR vs. Frequency 100k 1M 100 1k 10k Frequency (Hz) Output Current Drive 75 Vout Forced to Nominal - 50mV 50 25 ...

Page 12

... Gain = 1 Load = 1k ; 50pF Ω Small-Signal Response 20mV Gain = 1 Load = 1k ; 50pF Ω Step Response Setup Diagram G=1 Vin+ IA1 Vin- G=1 IA2 2.5V VREF1 ispPAC30 Preliminary Data Sheet 1µS 0.625V Gain = 1 Load = 1k ; 600pF 1µS 20mV Gain = 1 Load = 1k ; 600pF Cfb=min OA1 Vout Large-Signal Vin+ 0.0 V 2.0 V 0.0 V Vin- 2 ...

Page 13

... Device Input Cells In an ispPAC30 device, any input pin can be routed to any of the four input instrument amplifiers (IA), two of which have dual input multiplexers either of the two multiplying DAC’s (MDAC), or any combination of these. In addi- tion, either output amplifier (OA) can be routed to any or all of these same input cells. This enables great flexibility in how an ispPAC30 is confi ...

Page 14

... MDACs. By selective combination of these various settings, a very large number of user control offset voltages can be summed with any input signal. This is also the basis of how the ispPAC30 can be configured as a comparator. With the output amplifier configured as a comparator, an unknown signal is summed with a precise ref- erence value and an input above or below that reference level will cause a change in state of the output compara- tor ...

Page 15

... Increasing MDAC Effective Resolution Because the value of the ispPAC30’s voltage references can be set to several output voltages, ranging from 64mV to 2.5V possible to use high-value MDAC settings (>50% full scale) to synthesize most desired thresholds. This means that a given threshold (32mV or greater) can be set with a resolution of +/-0.8%. ...

Page 16

... As mentioned in the previous IA section, any input voltage between 0 to 2.8V can be applied directly to an ispPAC30 input. To keep the output from trying to swing below 0V, if Vin- is more positive than Vin+, an offsetting signal must be applied to the appropriate summing node to balance or counteract the negative input. Single-ended connections, however, only require that the minus input be connected some other fi ...

Page 17

... used to reference a high impedance source (e.g., one that does not require more than 40µA), the VREF directly. An example is shifting the DC level of a signal connected to the input pin of an ispPAC30. Also, by using a current limiting resistor with the VREF ence ...

Page 18

... The feedback capacitance set is required to maintain necessary stability. When used in filter mode, the ispPAC30 differs from the wideband amplifier in that it has seven alternative feedback capacitor values available to form the lowpass filter corner frequencies. See Table 3 for these values (listed as the maximum corner frequencies in the precision fi ...

Page 19

... DC gain. This increase must be compensated for if the filter is to maintain unity gain from input to output. Because there are two MDACs in an ispPAC30, one way to do this is to attenuate the input signal through MDAC1 by the same amount the feedback signal is attenuated by MDAC2. To maintain signal polarity, however, MDAC1 should be set to a positive gain ...

Page 20

... In addition to full power-down mode, either of the output amplifiers can be shut down independently of all other cir- cuitry. This can be done at any time by setting internal E sumption while the rest of the ispPAC30 is in normal operation. This could also be accomplished at the time the device is programmed initially via dialog box commands available in the PAC-Designer software. Note: Any IA or MDAC that has nothing connected to its input is also automatically shut down. JTAG User Confi ...

Page 21

... Electronic Security Fuse Auto-Calibration Mode Every time the ispPAC30 is powered up, an automatic auto-calibration sequence is initiated. If this adversely affects system operation, provisions must be incorporated that minimize the result as auto-calibration cannot be defeated. The auto-calibration of the ispPAC30 effectively isolates it from external connections and drives the inputs of the device to 0V and checks to see that there is zero offset at the outputs ...

Page 22

... SPI mode can be enabled via the logic level setting of the ENSPI pin. To achieve full control of an ispPAC30, all possible bits used in configuration (112) must be set each time the configuration is updated. This full set of configuration bits is referred to as the CFG or confi ...

Page 23

... Lattice Semiconductor Figure 6. PAC-Designer Design Entry Screen PAC Designer - [ispPAC30.PAC: Schematic] File Edit View MSEL1 = 0 (a) IN1 IN2 IN3 IN4 MSEL2 = 0 (a) Ready Design Simulation Capability A powerful feature of PAC-Designer is its simulation capability, enabling quick and accurate verification of circuit operation and performance. Once a circuit is configured via the interactive design process, gain and phase response between any input and output can then be simulated. This function is part of the simulator capability which derives a transfer equation between the two points and then sweeps it over the user-specifi ...

Page 24

... IEEE Standard 1149.1 Interface Serial Port Programming Interface Communication with the ispPAC30 is facilitated via an IEEE 1149.1 test access port (TAP used by the ispPAC30 as a serial programming interface, and not for boundary scan test purposes. 2 CMOS memory of the ispPAC30. This consists of 16 ...

Page 25

... A separate set of SRAM registers are pre- loaded at turn-on and determine the configuration of the ispPAC30 while it is under power. By cycling the TAP con- troller through the necessary states, data can also be shifted out of the configuration register to verify the current ispPAC30 confi ...

Page 26

... This is when the device is actually programmed, erased or verified. All other instructions are executed in the Update state Select-DR-Scan 0 1 Capture-DR 0 Shift- Exit1-DR 0 Pause- Exit2-DR 1 Update- ispPAC30 Preliminary Data Sheet 1 Select-IR-Scan 0 1 Capture-IR 0 Shift- Exit1-IR 0 Pause- Exit2-IR 1 Update- ...

Page 27

... TDI and TDO and allows serial data to be transferred through the device without affecting the operation of the ispPAC30. The bit code of this instruction is defined to be all ones by the IEEE 1149.1 standard. With ispPAC30, any instruction beginning with a one will default to BYPASS. ...

Page 28

... JTAG and SPI device programming control of the ispPAC30 (specific bit assignments, word lengths, etc.). There are two unique load instructions specified by Lattice for the ispPAC30. They are the LATCHCFG (load CFG register) and RELOADCFG (load CFG from E ...

Page 29

... The POWERDN (power down command) and POWERUP (power up command) are unique instructions specified by Lattice for the ispPAC30 to command the normal and low-power or shut-down states of the device. As with other instructions above, these instructions do not begin until entry of the Run-Test/Idle state. Timing for coming out of power-down mode as well as supply current used in this mode are specifi ...

Page 30

... Lattice Semiconductor Package Diagrams 28-Pin PDIP (Dimensions in inches) 24-Pin SOIC (Dimensions in millimeters) ispPAC30 Preliminary Data Sheet 30 ...

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