74CBTLV1G125GW,125 NXP Semiconductors, 74CBTLV1G125GW,125 Datasheet
74CBTLV1G125GW,125
Specifications of 74CBTLV1G125GW,125
74CBTLV1G125GW,125
74CBTLV1G125GW-G
74CBTLV1G125GW-G
935280319125
Related parts for 74CBTLV1G125GW,125
74CBTLV1G125GW,125 Summary of contents
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Single bus switch Rev. 2 — 29 July 2010 1. General description The 74CBTLV1G125 provides a single high-speed line switch. The switch is disabled when the output enable (OE) input is high. To ensure the high-impedance OFF-state during power ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 74CBTLV1G125GW −40 °C to +125 °C −40 °C to +125 °C 74CBTLV1G125GV −40 °C to +125 °C 74CBTLV1G125GM −40 °C to +125 °C 74CBTLV1G125GF −40 °C to +125 °C 74CBTLV1G125GN −40 °C to +125 °C 74CBTLV1G125GS 4 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74CBTLV1G125 GND 001aad715 Fig 3. Pin configuration SOT353-1 and SOT753 6.2 Pin description Table 3. Pin description Symbol Pin SOT353-1, SOT753 SOT886, SOT891, SOT1115 and SOT1202 GND n. Functional description 7.1 Function table [1] Table 4. Function table Output enable input OE ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V switch voltage SW I input clamping current IK I switch clamping current SK I switch current ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I power-off leakage current OFF I supply current CC ΔI additional supply current CC C input capacitance I C switch capacitance sw = −40 °C to +125 °C T amb V HIGH-level input voltage IH V LOW-level input voltage ...
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... NXP Semiconductors GND Fig 6. Test circuit for measuring OFF-state leakage current Fig 8. Test circuit for measuring ON-resistance 74CBTLV1G125 Product data sheet 001aad716 Fig GND All information provided in this document is subject to legal disclaimers. Rev. 2 — 29 July 2010 74CBTLV1G125 Single bus switch V CC ...
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... NXP Semiconductors (Ω 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb 2 mA (Ω 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb 2 mA Fig 9. Switch ON-resistance as a function of input voltage at V ...
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... NXP Semiconductors (Ω 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb 3 mA (Ω 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb = −40 °C (4) T amb 3 mA Fig 10. Switch ON-resistance as a function of input voltage at V ...
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... NXP Semiconductors 11. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; see Figure 13. Symbol Parameter Conditions t propagation delay see enable time see disable time see dis [1] All typical values are measured at T [2] The propagation delay is the calculated RC time constant of the maximum on-state resistance of the switch and the load capacitance, when driven by an ideal voltage source (zero output impedance) ...
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... NXP Semiconductors LOW-to-OFF OFF-to-LOW HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 12. Enable and disable times Table 11. Measurement points Supply voltage Input 0.5 × 2.7 V 0.5 × 3.6 V 74CBTLV1G125 Product data sheet input V M GND t PLZ V CC ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to the output impedance Test voltage for switching times. EXT Fig 13. Test circuit for measuring switching times Table 12. ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 14 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 15. Package outline SOT753 74CBTLV1G125 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2.5 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 17 ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 14. Abbreviations Table 13. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 14. Revision history Document ID Release date 74CBTLV1G125 v.2 20100729 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74CBTLV1G125 Product data sheet 16 ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 7.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 Waveforms ...