S71WS-N SPANSION [SPANSION], S71WS-N Datasheet
S71WS-N
Related parts for S71WS-N
S71WS-N Summary of contents
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... Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information, Preliminary, or Full Production. See Publication Number S71WS-N_00 ™ Notice On Data Sheet Designations Revision A Amendment 6 S71WS-N Cover Sheet for definitions. Issue Date July 19, 2006 ...
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... Questions regarding these document designations may be directed to your local sales office range. Changes may also include those needed to clarify a IO S71WS S71WS-N_00_A6 July 19, 2006 ...
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... Power supply voltage of 1 1.95 V Burst Speed: 54 MHz, 66 MHz, 80 MHz General Description The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items: One or more flash memory die (for the S71WS512N, two S29WS256N devices are used) CellularRAM Type 2 pSRAM The products covered by this document are listed in the table below ...
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... DYB Power-Up pSRAM State (Cellular RAM) Package (See Note) Supplier (mm 8.0X11.6X1 8.0X11.6X1 11.6x8.0x1 9x12x1 11.6x8.0x1 11.6x8.0x1 9x12x1 S71WS-N_00_A6 July 19, 2006 ...
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... S71WS128N S71WS256N S71WS512N Package Marking Note: The package marking omits the leading S from the ordering part number. July 19, 2006 S71WS-N_00_A6 ( ...
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... disables program and erase functions in the four outermost sectors. Should be IL for all other conditions accelerates programming; automatically places device in unlock bypass mode S71WS for all other conditions. IH S71WS-N_00_A6 July 19, 2006 , IL ...
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... Only needed for S71WS512N. 4. For the 128M pSRAM devices, there are 23 shared addresses. 5. Connection Diagrams/Physical Dimensions This section contains the I/O designations and package specifications for the S71WS-N. 5.1 Special Handling Instructions for FBGA Packages Special handling is required for Flash Memory products in FBGA packages. ...
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... E8 E9 2nd Flash only A13 A21 F9 F8 RAM only A14 A22 G8 G9 RFU A16 H9 H8 DQ15 R-CRE J8 J9 DQ7 DQ14 RFU L8 L9 RFU RFU M10 DNU Shared Addresses A20-A0 A21-A0 A21 – A0 A22 – A0 A21-A0 A22-A0 S71WS-N_00_A6 July 19, 2006 ...
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... Ø b 0.35 0.40 eE 0.80 BSC. eD 0.80 BSC 0.40 BSC. A2,A3,A4,A5,A6,A7,A8,A9 B1,B10,C1,C10,D1,D10, E1,E10,F1,F10,G1,G10, H1,H10,J1,J10,K1,K10,L1,L10, M2,M3,M4,M5,M6,M7,M8,M9 July 19, 2006 S71WS-N_00_A6 ( TOP VIEW 0.15 C (2X) 0.20 C 0.08 C SIDE VIEW MAX NOTE 1 ...
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... OUTER ROW 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. S71WS-N_00_A6 July 19, 2006 7 E1 3388 \ 16-038.21a ...
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... φb 0.35 0.40 eE 0.80 BSC. eD 0.80 BSC 0.40 BSC. A2,A3,A4,A5,A6,7,A8,A9 B1,B10,C1,C10,D1,D10 E1,E10,F1,F10,G1,G10 H1,H10,J1,J10,K1,K10,L1,L10 M2,M3,M4,M5,M6,M7,M8,M9 July 19, 2006 S71WS-N_00_A6 ( TOP VIEW 0.15 C (2X) 0.20 C 0.08 C SIDE VIEW A B MAX NOTE 1 ...
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... OUTER ROW 0.000. WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW e/2 8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK MARK, METALLIZED MARK INDENTATION OR OTHER MEANS. S71WS-N_00_A6 July 19, 2006 7 E1 3423 \ 16-038.21a ...
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... Copyright © 2004-2006 Spansion Inc. All Rights Reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof are trademarks of Spansion Inc. Other names are for informational purposes only and may be trademarks of their respective owners. July 19, 2006 S71WS-N_00_A6 ( ...