S71WS256PD0HFFLW0 SPANSION [SPANSION], S71WS256PD0HFFLW0 Datasheet - Page 14

• Manufacturer Part Number: S71WS256PD0HFFLW0
• Description: based MCP/POP Products
• Manufacturer: SPANSION [SPANSION]

7.2
12
FMC115 — 115-ball 12 x 9 mm MCP
PACKAGE
SYMBOL
SD SE
JEDEC
Ø
D x E
MD
ME
A1
A2
D1
E1
eE
eD
D
A
E
n
b
0.17
0.96
0.35
MIN
---
B3,B4,B5,B6,B7,B8,C1
12.00 mm x 9.00 mm
N3,N4,N5,N6,N7,N8
A3,A4,A5,A6,A7,A8
P3,P4,P5,P6,P7,P8
12.00 BSC.
PACKAGE
9.00 BSC.
10.4 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
FMC 115
NOM
0.40
N/A
115
---
---
---
14
10
D a t a
S75WS-P based MCP/POP Products
MAX
1.40
1.11
0.45
---
S h e e t
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
( A d v a n c e
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
I n f o r m a t i o n )
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S75WS-P_00_02 September 6, 2006
3603 \ 16-038.19 \ 9.6.6