74AUP2G157DC,125 NXP Semiconductors, 74AUP2G157DC,125 Datasheet
74AUP2G157DC,125
Specifications of 74AUP2G157DC,125
74AUP2G157DC-G
935280734125
Related parts for 74AUP2G157DC,125
74AUP2G157DC,125 Summary of contents
Page 1
Low-power 2-input multiplexer Rev. 4 — 30 July 2010 1. General description The 74AUP2G157 is a single 2-input multiplexer which select data from two data inputs (I0 and I1) under control of a common data select input (S). The ...
Page 2
... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name −40 °C to +125 °C 74AUP2G157DC −40 °C to +125 °C 74AUP2G157GT −40 °C to +125 °C 74AUP2G157GF −40 °C to +125 °C 74AUP2G157GD −40 °C to +125 °C 74AUP2G157GM −40 °C to +125 °C 74AUP2G157GN − ...
Page 3
... NXP Semiconductors 1 I0 SELECTOR Fig 3. Logic diagram 6. Pinning information 6.1 Pinning 74AUP2G157 GND 4 001aaf513 Fig 5. Pin configuration SOT765-1 74AUP2G157 Product data sheet MULTIPLEXER I1 3 OUTPUT 001aaf511 Fig Fig 6. All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 July 2010 74AUP2G157 ...
Page 4
... NXP Semiconductors 74AUP2G157 GND 4 Transparent top view Fig 7. Pin configuration SOT996-2 6.2 Pin description Table 3. Pin description Symbol Pin SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level don’t care. ...
Page 5
... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
Page 6
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF ΔI additional power-off OFF leakage current I supply current CC ΔI ...
Page 7
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF ΔI additional power-off OFF leakage current I supply current CC ΔI ...
Page 8
... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF ΔI additional power-off OFF leakage current I supply current CC ΔI ...
Page 9
... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay I0 see see see 74AUP2G157 Product data sheet Figure Min [2] Figure 1 1 1. 2 ...
Page 10
... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay I0 see see see 74AUP2G157 Product data sheet …continued Figure Min [2] Figure 1 1 1. 2 ...
Page 11
... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay I0 see see see 74AUP2G157 Product data sheet …continued Figure Min [2] Figure 1 1 1. 2 ...
Page 12
... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay I0 see see see 74AUP2G157 Product data sheet …continued Figure Min [2] Figure 1 1 1. 2 ...
Page 13
... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions pF and power dissipation MHz capacitance [1] All typical values are measured at nominal V [ the same as t and t pd PLH PHL [ used to determine the dynamic power dissipation (P PD × ...
Page 14
... NXP Semiconductors E input GND output output V OL Measurement points are given in Logic levels: V and Fig 10. The enable input (E) to output (Y, Y) propagation delays Table 9. Measurement points Supply voltage Output 0.5 × 3.6 V Test data is given in Table Definitions for test circuit Load resistance ...
Page 15
... NXP Semiconductors 13. Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
Page 16
... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
Page 17
... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 18
... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 15. Package outline SOT996-2 (XSON8U) ...
Page 19
... NXP Semiconductors XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm terminal 1 index area metal area not for soldering 2 1 terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.25 1.65 mm 0.5 0.00 ...
Page 20
... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.25 mm nom 0.15 1.20 min 0.12 1.15 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 21
... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
Page 22
... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 15. Revision history Table 12. Revision history Document ID Release date 74AUP2G157 v.4 20100730 • Modifications: Added type number 74AUP2G157GF (SOT1089/XSON8 package). ...
Page 23
... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
Page 24
... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74AUP2G157 Product data sheet 16 ...
Page 25
... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Package outline ...