KFM2G16Q2M-DEB5 SAMSUNG [Samsung semiconductor], KFM2G16Q2M-DEB5 Datasheet - Page 62
![no-image](/images/no-image-200.jpg)
KFM2G16Q2M-DEB5
Manufacturer Part Number
KFM2G16Q2M-DEB5
Description
MuxOneNAND FLASH MEMORY
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet
1.KFM2G16Q2M-DEB5.pdf
(124 pages)
- Current page: 62 of 124
- Download datasheet (2Mb)
MuxOneNAND1G(KFM1G16Q2M-DEB5)
MuxOneNAND2G(KFN2G16Q2M-DEB5)
3.0
3.1
This section of the datasheet discusses the operation of the MuxOneNAND device. It is followed by AC/DC
Characteristics and Timing Diagrams which may be consulted for further information.
The MuxOneNAND supports a limited command-based interface in addition to a register-based interface for performing operations
on the device.
The command-based interface is active in the boot partition. Commands can only be written with a boot area address. Boot area data
is only returned if no command has been issued prior to the read.
The entire address range, except for the boot area, can be used for the data buffer. All commands are written to the boot partition.
Writes outside the boot partition are treated as normal writes to the buffers or registers.
The command consists of one or more cycles depending on the command. After completion of the command the device starts its exe-
cution. Writing incorrect information including address and data to the boot partition or writing an improper command will terminate
the previous command sequence and make the device enter the ready status.
The defined valid command sequences are stated in Command Sequences Table.
Command Sequences
NOTE:
1) DP(Data Partition) : DataRAM Area
2) BP(Boot Partition) : BootRAM Area [0000h ~ 01FFh, 8000h ~ 800Fh].
3) Load Data into Buffer operation is available within a block(128KB)
4) Load 2KB unit into DataRAM0. Current Start address(FPA) is automatically incremented by 2KB unit after the load.
5) 0000h -> Data is Manufacturer ID
6) WE toggling can terminate ’Read Identification Data’ operation.
0001h -> Data is Device ID
0002h -> Current Block Write Protection Status
Read Identification Data
Read Data from Buffer
Load Data into Buffer
Reset MuxOneNAND
Write Data to Buffer
DEVICE OPERATION
Command Based Operation
Command Definition
3)
6)
Data
Data
Data
Data
Data
Add
Add
Add
Add
Add
62
Cycles
1
1
1
2
2
1st cycle
00E0h
00F0h
0090h
FLASH MEMORY
Data
Data
DP
BP
DP
BP
BP
1)
2)
2nd cycle
XXXXh
0000h
Data
BP
4)
5)
Related parts for KFM2G16Q2M-DEB5
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![IRF123](/images/no-image3.png)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![IRF153](/images/no-image3.png)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![IRF222](/images/no-image3.png)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![IRF253](/images/no-image3.png)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![IRF423](/images/no-image3.png)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![K4D551638F-TC50](/images/manufacturer_photos/0/5/577/samsung_tmb.jpg)
Part Number:
Description:
K4D551638F-TC50Samsung semiconductor [256Mbit GDDR SDRAM]
Manufacturer:
Samsung
Datasheet:
![K5A3280YBC-T755](/images/manufacturer_photos/0/5/577/samsung_tmb.jpg)
Part Number:
Description:
K5A3280YBC-T755Samsung semiconductor [MCP MEMORY]
Manufacturer:
Samsung
Datasheet:
![S1T8602B01-S0B0](/images/no-image3.png)
Part Number:
Description:
LOW VOLTAGE AUDIO AMPLIFIER
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![KS8620D](/images/no-image3.png)
Part Number:
Description:
1 Chip CODEC for Digital Answering phone
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![KS8803](/images/no-image3.png)
Part Number:
Description:
10/15 CH PLL
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![KA7531D](/images/no-image3.png)
Part Number:
Description:
BALLAST CONTROL IC
Manufacturer:
SAMSUNG [Samsung semiconductor]
Datasheet:
![IRF252](/images/manufacturer_photos/0/5/578/samsung_semiconductor_tmb.jpg)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
Samsung semiconductor
Datasheet:
![IRF342](/images/manufacturer_photos/0/5/578/samsung_semiconductor_tmb.jpg)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
Samsung semiconductor
Datasheet:
![IRF422](/images/manufacturer_photos/0/5/578/samsung_semiconductor_tmb.jpg)
Part Number:
Description:
N-CHANNEL POWER MOSFETS
Manufacturer:
Samsung semiconductor
Datasheet:
![irfs630](/images/no-image3.png)
Part Number:
Description:
Transistor,mosfet,n-channel,200v V Br Dss,5.9a
Manufacturer:
Samsung Semiconductor, Inc.
Datasheet: