MF1ICS7001 PHILIPS [NXP Semiconductors], MF1ICS7001 Datasheet - Page 4

• Manufacturer Part Number: MF1ICS7001
• Description: Standard 4Kbyte card IC sawn wafer on UV-tape addendum
• Manufacturer: PHILIPS [NXP Semiconductors]

NXP Semiconductors
6. Chip orientation and bond pad locations
101731
Product data sheet
Fig 1. Chip orientation and bond pad locations
(1 ) x - Scribeline width
(2 ) y - Scribeline width
(3 ) Chip step, x- length
(4 ) Chip step, y- length
(1)
(2)
Y
TESTIO
(6)
VSS
(5)
86. 4 µm
86. 4 µm
1
1. 34 mm
. 42 mm
LA
Rev. 3.1 — 18 April 2007
(3)
LB
(7)
1)
2)
(5 )
(6 )
(7 )
(8 )
VSS ( 108 x 108)
TESTIO ( 95 x 110)
LA ( 118 x118)
LB ( 118 x118)
PAD location
Reference point :
Pad size in µm
(8)
Widths and lengths are measured from metal to metal
LA pad edge to chip edgey -length
LB pad edge to chip edgey - length
LB pad edge to chip edgex - length
LA pad edge to chip edge - length
1
2
MF1 IC S70 01
Lower left corner of pad
x [ µm]
x
1160 ..9
Standard 4Kbyte card IC
223.4
-1 .1
0.0
(4)
251 . 8 µm
© NXP B.V. 2007. All rights reserved.
28. 6 µm
26. 8 µm
26. 2 µm
X
y [ µm]
1081 .9
1091 .9
( top layer).
.
0.0
1.7
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