SSTU32864EC/G,557 NXP Semiconductors, SSTU32864EC/G,557 Datasheet - Page 15

• Manufacturer Part Number: SSTU32864EC/G,557
• Description: IC 25BIT CONFIG REG BUFF 96LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTU32864EC/G,557

• Logic Type: 1:1, 1:2 Configurable Registered Buffer
• Supply Voltage: 1.7 V ~ 1.9 V
• Number Of Bits: 25, 14
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2052; 935275429557; SSTU32864EC/G

Philips Semiconductors
11. Package outline
Fig 16. Package outline SOT536-1 (LFBGA96)
9397 750 14092
Product data sheet
LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT536-1
max.
1.5
A
0.41
0.31
A
1
ball A1
index area
ball A1
index area
1.2
0.9
A
2
IEC
0.51
0.41
M
G
T
R
P
N
L
K
H
F
E
D
C
B
A
J
b
e
1
5.6
5.4
D
2
3
1/2
e 1
D
13.6
13.4
4
e
E
b
5
JEDEC
6
1.8 V configurable registered buffer for DDR2 RDIMM applications
0.8
e
0
REFERENCES
1/2
Rev. 02 — 22 October 2004
B
e
e
e
4
1
w
v
e 2
A
E
M
M
12
e
C
C
2
JEITA
scale
A
5
0.15
B
v
0.1
w
A
A
10 mm
0.1
2
y
y 1 C
A
1
0.2
y
1
detail X
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
EUROPEAN
X
C
y
SSTU32864
ISSUE DATE
00-03-04
03-02-05
SOT536-1
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