MAX1034BEUG+ Maxim Integrated, MAX1034BEUG+ Datasheet - Page 12

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MAX1034BEUG+

Manufacturer Part Number
MAX1034BEUG+
Description
Analog to Digital Converters - ADC 8-/4-Channel, Multirange Inputs,
Manufacturer
Maxim Integrated
Datasheet

Specifications of MAX1034BEUG+

Rohs
yes
Number Of Channels
8/4
Architecture
SAR
Conversion Rate
115 kSPs
Resolution
14 bit
Input Type
Single-Ended/Differential
Snr
84.5 dB
Interface Type
3-Wire, QSPI, SPI
Operating Supply Voltage
2.7 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
TSSOP-24
Maximum Power Dissipation
1111.1 mW
Minimum Operating Temperature
- 40 C
Number Of Converters
1
Voltage Reference
4.136 V
8-/4-Channel, ±V
Serial 14-Bit ADCs
12
MAX1034 MAX1035
10
11
12
13
14
15
16
17
18
19
20
______________________________________________________________________________________
1
2
3
4
5
6
7
8
9
PIN
10
11
12
13
14
15
16
17
2
3
4
5
6
7
8
9
DGNDO
REFCAP
DVDDO
AVDD1
SSTRB
NAME
DGND
DOUT
DVDD
SCLK
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
DIN
REF
CS
Analog Supply Voltage 1. Connect AVDD1 to a +4.75V to +5.25V power-supply voltage.
Bypass AVDD1 to AGND1 with a 0.1µF capacitor.
Analog Input Channel 0
Analog Input Channel 1
Analog Input Channel 2
Analog Input Channel 3
Analog Input Channel 4
Analog Input Channel 5
Analog Input Channel 6
Analog Input Channel 7
Active-Low Chip-Select Input. When CS is low, data is clocked into the device from DIN on
the rising edge of SCLK. With CS low, data is clocked out of DOUT on the falling edge of
SCLK. When CS is high, activity on SCLK and DIN is ignored and DOUT is high impedance.
Serial Data Input. When CS is low, data is clocked in on the rising edge of SCLK. When CS is
high, transitions on DIN are ignored.
Serial-Strobe Output. When using the internal clock, SSTRB rising edge transitions indicate
that data is ready to be read from the device. When operating in external clock mode, SSTRB
is always low. SSTRB does not tri-state, regardless of the state of CS, and therefore requires
a dedicated I/O line.
Serial Clock Input. When CS is low, transitions on SCLK clock data into DIN and out of DOUT.
When CS is high, transitions on SCLK are ignored.
Serial Data Output. When CS is low, data is clocked out of DOUT with each falling SCLK
transition. When CS is high, DOUT is high impedance.
D i gi tal I/O Gr ound . D GND , DGN D O, AGN D 3, AGND 2, and AGN D1 m ust be connected tog ether.
Digital Ground. DGND, DGNDO, AGND3, AGND2, and AGND1 must be connected together.
Digital I/O Supply Voltage Input. Connect DVDDO to a +2.7V to +5.25V power-supply voltage.
Bypass DVDDO to DGNDO with a 0.1µF capacitor.
Digital-Supply Voltage Input. Connect DVDD to a +4.75V to +5.25V power-supply voltage.
Bypass DVDD to DGND with a 0.1µF capacitor.
Bandgap-Voltage Bypass Node. For external reference operation, connect REFCAP to AVDD
or internal reference operation, bypass REFCAP with a 0.01µF capacitor to AGND1 (V
≈ 4.096V).
Reference-Buffer Output/ADC Reference Input. For external reference operation, apply an
external reference voltage from 3.800V to 4.136V to REF. For internal reference operation,
bypassing REF with a 1µF capacitor to AGND1 sets V
REF
Multirange Inputs,
FUNCTION
REF
= 4.096V ±1%.
Pin Description
REFCAP

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