74HC283D,653 NXP Semiconductors, 74HC283D,653 Datasheet
74HC283D,653
Specifications of 74HC283D,653
74HC283D-T
933757290653
Related parts for 74HC283D,653
74HC283D,653 Summary of contents
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Rev. 03 — 11 November 2004 1. General description The 74HC283 is a high-speed Si-gate CMOS device and is pin compatible with low power Schottky TTL (LSTTL). The 74HC283 is specified in ...
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Philips Semiconductors 3. Quick reference data Table 1: GND = Symbol PHL PLH [ input frequency in MHz output ...
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Philips Semiconductors 5. Functional diagram Fig 1. Functional diagram Fig 3. IEC logic symbol 9397 750 13811 Product data sheet 9 COUT ...
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Philips Semiconductors CIN Fig 4. Logic diagram 6. Pinning information 6.1 Pinning Fig 5. Pin configuration 9397 750 13811 Product data sheet ...
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Philips Semiconductors 6.2 Pin description Table 3: Symbol CIN GND COUT Functional description 7.1 Function table [1] Table 4: Function table Pins Input CIN A4 ...
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Philips Semiconductors 8. Limiting values Table 5: In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol GND ...
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Philips Semiconductors 10. Static characteristics Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter amb V HIGH-level input voltage IH V LOW-level input voltage IL V ...
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Philips Semiconductors Table 7: Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current LI I quiescent supply current ...
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Philips Semiconductors 11. Dynamic characteristics Table 8: Dynamic characteristics GND = ns pF; see Symbol Parameter amb propagation delay CIN ...
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Philips Semiconductors Table 8: Dynamic characteristics GND = ns pF; see Symbol Parameter output transition time THL TLH C power dissipation capacitance PD T ...
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Philips Semiconductors Table 8: Dynamic characteristics GND = ns pF; see Symbol Parameter +125 C amb propagation delay CIN ...
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Philips Semiconductors 12. Waveforms Fig 6. Waveforms showing the inputs (CIN, An and Bn) to the outputs (Sn and COUT) Fig 7. Load circuitry for switching times Table 9: Supply V CC 2.0 V 4.5 V 6.0 V 5.0 V ...
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Philips Semiconductors the second stage on S3. As long as A3 and B3 are the same, HIGH or LOW, they do not influence S3. Similarly, when A3 and B3 are the same, the carry into the third stage does not ...
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Philips Semiconductors 14. Package outline DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...
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Philips Semiconductors SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 ...
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Philips Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1.80 mm ...
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Philips Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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Philips Semiconductors 15. Revision history Table 10: Revision history Document ID Release date 74HC283_3 20041111 • Modifications: The format of this data sheet has been redesigned to comply with the current presentation and information standard of Philips Semiconductors. • Removed ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...