SSTUG32868ET/G,518 NXP Semiconductors, SSTUG32868ET/G,518 Datasheet - Page 2

• Manufacturer Part Number: SSTUG32868ET/G,518
• Description: IC BUFFER 1.8V 25BIT 176-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUG32868ET/G,518

• Logic Type: 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935284276518; SSTUG32868ET/G-T; SSTUG32868ET/G-T

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
SSTUG32868_1
Product data sheet
Type number
SSTUG32868ET/G
SSTUG32868ET/S
Ordering information
4.1 Ordering options
Solder process
Pb-free (SnAgCu solder ball
compound)
Pb-free (SnAgCu solder ball
compound)
I
I
I
I
I
I
I
I
Table 2.
Type number
SSTUG32868ET/G
SSTUG32868ET/S
Two additional chip select inputs allow optional flexible enabling and disabling
Supports Stub Series Terminated Logic SSTL_18 data inputs
Differential clock (CK and CK) inputs
Supports Low Voltage Complementary Metal Oxide Semiconductor (LVCMOS)
switching levels on the control and RESET inputs
Single 1.8 V supply operation (1.7 V to 2.0 V)
Available in 176-ball 6 mm
400 MT/s to 800 MT/s high-density (for example, 2 rank by 4) DDR2 registered DIMMs
DDR2 Registered DIMMs (RDIMM) desiring parity checking functionality
Ordering options
Rev. 01 — 23 April 2007
Temperature range
T
T
Package
Name
TFBGA176 plastic thin fine-pitch ball grid array package;
TFBGA176 plastic thin fine-pitch ball grid array package;
amb
amb
1.8 V DDR2-1G configurable registered buffer with parity
= 0 C to +70 C
= 0 C to +85 C
15 mm, 0.65 mm ball pitch TFBGA package
Description
176 balls; body 6
176 balls; body 6
15
15
0.7 mm
0.7 mm
SSTUG32868
© NXP B.V. 2007. All rights reserved.
Version
SOT932-1
SOT932-1
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