SSTUG32868ET/G,518 NXP Semiconductors, SSTUG32868ET/G,518 Datasheet - Page 24

• Manufacturer Part Number: SSTUG32868ET/G,518
• Description: IC BUFFER 1.8V 25BIT 176-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUG32868ET/G,518

• Logic Type: 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935284276518; SSTUG32868ET/G-T; SSTUG32868ET/G-T

NXP Semiconductors
12. Package outline
Fig 23. Package outline SOT932-1 (TFBGA176)
SSTUG32868_1
Product data sheet
TFBGA176: plastic thin fine-pitch ball grid array package; 176 balls; body 6 x 15 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT932-1
VERSION
OUTLINE
max
1.15
A
0.35
0.25
A
1
0.80
0.65
A
2
ball A1
index area
ball A1
index area
IEC
- - -
0.45
0.35
b
AB
M
K
H
D
B
Y
V
T
P
F
AA
W
U
R
N
G
C
A
L
J
E
6.1
5.9
D
1
2
e
3
1/2 e
15.1
14.9
4
MO-246
e
D
JEDEC
E
1
5
b
6
7
0.65
REFERENCES
8
e
0
Rev. 01 — 23 April 2007
1/2 e
4.55
B
e
e
1
w
v
e
A
E
1.8 V DDR2-1G configurable registered buffer with parity
13.65
2
JEITA
M
M
e
- - -
2
scale
C
C
5
A
0.15
v
B
A
0.08
w
A
10 mm
2
0.1
y
A
y
1
1
C
detail X
0.1
y
1
PROJECTION
C
EUROPEAN
X
y
SSTUG32868
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
06-01-11
06-01-16
SOT932-1
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