LPC11A11FHN33/001, NXP Semiconductors, LPC11A11FHN33/001, Datasheet - Page 76

• Manufacturer Part Number: LPC11A11FHN33/001,
• Description: ARM Microcontrollers - MCU CortexM0 32bit 8KB
• Manufacturer: NXP Semiconductors

Specifications of LPC11A11FHN33/001,

• Rohs: yes
• Core: ARM Cortex M0
• Processor Series: LPC11A
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 2 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 2.6 V to 3.6 V
• Package / Case: HVQFN-33
• Mounting Style: SMD/SMT
• Factory Pack Quantity: 260

NXP Semiconductors
LPC11AXX
Product data sheet
Fig 39. Reflow soldering of the HVQFN33(7x7) package
Footprint information for reflow soldering of HVQFN33 package
solder land
solder paste deposit
occupied area
solder land plus solder paste
solder resist
Dimensions in mm
All information provided in this document is subject to legal disclaimers.
SPD = 1.00 SP
Rev. 4 — 30 October 2012
0.20 SR
chamfer (4×)
PID = 7.25 PA+OA
OwDtot = 5.10 OA
SDhtot = 2.70 SP
OID = 8.20 OA
DHS = 4.85 CU
LbD = 5.80 CU
LaD = 7.95 CU
evia = 4.25
evia = 2.40
4.55 SR
Remark:
Stencil thickness: 0.125 mm
GapD = 0.70 SP
e = 0.65
32-bit ARM Cortex-M0 microcontroller
W = 0.30 CU
0.45 DM
(A-side fully covered)
number of vias: 20
B-side
LPC11Axx
© NXP B.V. 2012. All rights reserved.
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
001aao134
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