74LVTH16245BBX,518 NXP Semiconductors, 74LVTH16245BBX,518 Datasheet - Page 2

• Manufacturer Part Number: 74LVTH16245BBX,518
• Description: Bus Transceivers 16bit Xceive 3.3V 1W
• Manufacturer: NXP Semiconductors

Specifications of 74LVTH16245BBX,518

• Rohs: yes
• Logic Type: Transceivers
• Propagation Delay Time: 3.3 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Temperature: + 125 C
• Package / Case: HXQFN-60
• Maximum Power Dissipation: 1000 mW
• Mounting Style: SMD/SMT
• Number Of Lines (input / Output): / /
• Factory Pack Quantity: 5000

NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVT_LVTH16245B
Product data sheet
Type number
74LVT16245BDL
74LVTH16245BDL
74LVT16245BDGG
74LVTH16245BDGG
74LVT16245BEV
74LVT16245BBX
74LVTH16245BBX
Fig 1.
Pin numbers are shown for SSOP48 and TSSOP48 packages only.
Logic symbol
Ordering information
1DIR
Package
Temperature range
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +125 C
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
All information provided in this document is subject to legal disclaimers.
Name
SSOP48
TSSOP48
VFBGA56
HXQFN60
Rev. 10 — 1 March 2012
74LVT16245B; 74LVTH16245B
1B0
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1OE
Description
plastic shrink small outline package; 48 leads;
body width 7.5 mm
plastic thin shrink small outline package; 48 leads;
body width 6.1 mm
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5  7  0.65 mm
plastic compatible thermal enhanced extremely
thin quad flat package; no leads; 60 terminals;
body 4  6  0.5 mm
2DIR
2A0
2A1
2A2
2A3
2A4
2A5
2A6
2A7
3.3 V 16-bit transceiver; 3-state
001aaa789
2OE
2B0
2B1
2B2
2B3
2B4
2B5
2B6
2B7
© NXP B.V. 2012. All rights reserved.
Version
SOT370-1
SOT362-1
SOT702-1
SOT1134-2
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