74AVC16245DGG-T NXP Semiconductors, 74AVC16245DGG-T Datasheet
74AVC16245DGG-T
Specifications of 74AVC16245DGG-T
Related parts for 74AVC16245DGG-T
74AVC16245DGG-T Summary of contents
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... Low inductance multiple VCC and GND pins to minimize noise and ground bounce Supports Live Insertion 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 40 C to +85 C 74AVC16245DGG Figure 4 and Figure 5) Description TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm Product data sheet ...
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... NXP Semiconductors 4. Functional diagram 1DIR 1A0 1A1 1A2 1A3 1A4 1A5 1A6 1A7 Fig 1. Logic symbol 74AVC16245 Product data sheet 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 2DIR 1OE 2A0 1B0 2A1 1B1 2A2 1B2 2A3 1B3 2A4 1B4 2A5 1B5 ...
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... NXP Semiconductors Fig 2. IEC logic symbol 74AVC16245 Product data sheet 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 1OE G3 1DIR 3EN1[BA] 3EN2[AB] G6 2OE 6EN1[BA] 2DIR 6EN2[AB] 1B0 1A0 1 2 1A1 1B1 1A2 1B2 1B3 1A3 1A4 1B4 1A5 1B5 1B6 1A6 1A7 ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 3. Pin configuration 74AVC16245 Product data sheet 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state $9& 2( ', $ % $ % *1' * $ % $ % && && % $ % $ *1' * $ % $ % $ % % $ ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 1DIR, 2DIR 1, 24 1B0 to 1B7 11, 12 2B0 to 2B7 13, 14, 16, 17, 19, 20, 22, 23 GND 4, 10, 15, 21, 28, 34, 39 18, 31 1OE, 2OE 48, 25 1A0 to 1A7 47, 46, 44, 43, 41, 40, 38, 37 ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I power-off leakage current OFF I OFF-state output current OZ I supply current CC C input capacitance I [1] All typical values are measured ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t propagation delay pd t enable time en t disable time dis C power dissipation PD capacitance [ the same as t and PLH PHL t is the same as t and t ...
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... NXP Semiconductors 11. Waveforms Measurement points are given in Logic levels: V and Fig 6. The input (nAn, nBn) to output (nBn, nAn) propagation delays nOE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 7 ...
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... NXP Semiconductors Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance External voltage for measuring switching times. EXT Fig 8. Test circuit for measuring switching times Table 9 ...
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... NXP Semiconductors 12. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm 1.2 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Release date Data sheet status 74AVC16245 v.3 20130131 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74AVC16245 v.2 19991115 74AVC16245 v.1 19981211 ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... V tolerant; 3-state NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics 9.1 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline ...