74LVC1G07GN,132 NXP Semiconductors, 74LVC1G07GN,132 Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G07GN,132
• Description: Buffers & Line Drivers Buffer
• Manufacturer: NXP Semiconductors

Specifications of 74LVC1G07GN,132

• Rohs: yes
• Factory Pack Quantity: 5000

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G07
Product data sheet
Type number
74LVC1G07GW
74LVC1G07GV
74LVC1G07GM
74LVC1G07GF
74LVC1G07GN
74LVC1G07GS
Type number
74LVC1G07GW
74LVC1G07GV
74LVC1G07GM
74LVC1G07GF
74LVC1G07GN
74LVC1G07GS
74LVC1G07GX
74LVC1G07GX
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
Logic symbol
Ordering information
Marking
A
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
mna623
Y
4
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
X2SON5
All information provided in this document is subject to legal disclaimers.
Fig 2.
A
Rev. 11 — 29 June 2012
IEC logic symbol
2
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1  1  0.5 mm
6 terminals; body 0.9  1.0  0.35 mm
6 terminals; body 1.0  1.0  0.35 mm
X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8  0.8  0.35 mm
Marking code
VS
V07
VS
VS
VS
VS
VS
mna624
4
Y
[1]
Fig 3.
Buffer with open-drain output
A
Logic diagram
74LVC1G07
© NXP B.V. 2012. All rights reserved.
GND
Y
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
SOT1226
mna591
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