MCIMX6S4AVM08ABR Freescale Semiconductor, MCIMX6S4AVM08ABR Datasheet - Page 36

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MCIMX6S4AVM08ABR

Manufacturer Part Number
MCIMX6S4AVM08ABR
Description
Processors - Application Specialized i.MX6 Solo rev 1.1
Manufacturer
Freescale Semiconductor
Type
Multimedia Applicationsr
Datasheet

Specifications of MCIMX6S4AVM08ABR

Rohs
yes
Core
ARM Cortex A9
Processor Series
i.MX6
Data Bus Width
32 bit
Maximum Clock Frequency
800 MHz
Data Ram Size
16 KB
Operating Supply Voltage
1.175 V to 1.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-624
Interface Type
Parallel
Memory Type
L1/L2 Cache, ROM, SRAM
Minimum Operating Temperature
- 40 C
Number Of Timers
2
Electrical Characteristics
4.5
4.5.1
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements an oscillator. The oscillator is powered from NVCC_PLL_OUT.
The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight
forward biased-inverter implementation is used.
4.5.2
This block implements an amplifier that when combined with a suitable quartz crystal and external load
capacitors implements a low power oscillator. It also implements a power mux such that it can be powered
from either a ~3 V backup battery (VDD_SNVS_IN) or VDDHIGH_IN such as the oscillator consumes
power from VDDHIGH_IN when that supply is available and transitions to the back up battery when
VDDHIGH_IN is lost.
In addition, if the clock monitor determines that the OSC32K is not present, then the source of the 32 K
will automatically switch to a crude internal ring oscillator. The frequency range of this block is
approximately 10–45 kHz. It highly depends on the process, voltage, and temperature.
The OSC32k runs from VDD_SNVS_CAP supply, which comes from the
VDDHIGH_IN/VDD_SNVS_IN. The target battery is a ~3 V coin cell. Proper choice of coin cell type is
necessary for chosen VDDHIGH_IN range. Appropriate series resistor (Rs) must be used when connecting
the coin cell. Rs depends on the charge current limit that depends on the chosen coin cell. For example, for
Panasonic ML621:
For a charge voltage of 3.2 V, Rs = (3.2-2.5)/0.6 m = 1.17 k
36
consumption
Current
Fosc
Average Discharge Voltage is 2.5 V
Maximum Charge Current is 0.6 mA
On-Chip Oscillators
OSC24M
OSC32K
i.MX 6Solo/6DualLite Automotive and Infotainment Applications Processors, Rev. 1
Min
32.768 KHz
Table 23. OSC32K Main Characteristics
4 μA
Typ
Max
This frequency is nominal and determined mainly by
the crystal selected. 32.0 K would work as well.
The 4 μA is the consumption of the oscillator alone
(OSC32k). Total supply consumption will depend on
what the digital portion of the RTC consumes. The
ring oscillator consumes 1 μA when ring oscillator is
inactive, 20 μA when the ring oscillator is running.
Another 1.5 μA is drawn from vdd_rtc in the
power_detect block. So, the total current is 6.5 μA on
vdd_rtc when the ring oscillator is not running.
Comments
Freescale Semiconductor

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