MT48LC32M16A2P-75:C TR Micron Technology Inc, MT48LC32M16A2P-75:C TR Datasheet - Page 29

• Manufacturer Part Number: MT48LC32M16A2P-75:C TR
• Description: IC SDRAM 512MBIT 133MHZ 54TSOP
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC32M16A2P-75:C TR

• Format - Memory: RAM
• Memory Type: SDRAM
• Memory Size: 512M (32Mx16)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-TSOP II
• Organization: 32Mx16
• Density: 512Mb
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Maximum Clock Rate: 133MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 115mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1078-2

Figure 18:
Figure 19:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
WRITE Burst
WRITE-to-WRITE
Note:
Note:
COMMAND
Data for any WRITE burst may be truncated with a subsequent READ command, and
data for a fixed-length WRITE burst may be immediately followed by a READ command.
After the READ command is registered, the data inputs will be ignored, and WRITEs will
not be executed. An example is shown in Figure 21 on page 30. Data n + 1 is either the
last of a burst of two or the last desired of a longer burst.
COMMAND
ADDRESS
ADDRESS
BL = 2. DQM is LOW.
DQM is LOW. Each WRITE command may be to any bank.
CLK
CLK
DQ
DQ
Transitioning Data
WRITE
WRITE
BANK,
COL n
BANK,
COL n
D
T0
D
T0
n
IN
n
IN
Transitioning Data
n + 1
NOP
n + 1
NOP
D
T1
T1
D
IN
IN
29
Don’t Care
WRITE
BANK,
COL b
NOP
T2
T2
D
b
IN
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Don’t Care
T3
NOP
512Mb: x4, x8, x16 SDRAM
©2000 Micron Technology, Inc. All rights reserved.
Operations