MT29F16G08DAAWP-ET:A TR Micron Technology Inc, MT29F16G08DAAWP-ET:A TR Datasheet - Page 80
MT29F16G08DAAWP-ET:A TR
Manufacturer Part Number
MT29F16G08DAAWP-ET:A TR
Description
IC FLASH 16GBIT 48TSOP
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F16G08DAAWP-ETA_TR.pdf
(81 pages)
Specifications of MT29F16G08DAAWP-ET:A TR
Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
16G (2G x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Other names
557-1413-2
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Figure 77:
PDF: 09005aef81b80e13/Source: 09005aef81b80eac
4gb_nand_m40a__2.fm - Rev. B 2/07 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
12.00 ±0.08
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
24
1
0.15
+0.03
-0.02
48-Pin TSOP OCPL Type 1 (WC Package Code)
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Note:
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
All dimensions are in millimeters.
development and data characterization sometimes occur.
20.00 ±0.25
18.40 ±0.08
their respective owners.
See detail A
80
4Gb, 8Gb, and 16Gb x8 NAND Flash Memory
®
1.20 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
48
25
0.10
0.25 for
reference only
0.50 for
reference only
+0.10
-0.05
0.10
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
Detail A
Mold compound:
Plated lead finish:
Package width and length do
not include mold protrusion.
Allowable protrusion is
0.25 per side.
Epoxy novolac
100% Sn
0.27 MAX
0.17 MIN
0.80
0.50 ±0.1
0.25
Gage
plane
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