CY7C1412AV18-167BZC Cypress Semiconductor Corp, CY7C1412AV18-167BZC Datasheet

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CY7C1412AV18-167BZC

Manufacturer Part Number
CY7C1412AV18-167BZC
Description
IC SRAM 36MBIT 167MHZ 165TFBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1412AV18-167BZC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
36M (2M x 18)
Speed
167MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
Q2668730

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1412AV18-167BZC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Cypress Semiconductor Corporation
Document #: 38-05615 Rev. *C
Features
Configurations
CY7C1410AV18 – 4M x 8
CY7C1425AV18 – 4M x 9
CY7C1412AV18 – 2M x 18
CY7C1414AV18 – 1M x 36
Selection Guide
Maximum Operating Frequency
Maximum Operating Current
• Separate Independent Read and Write data ports
• 250-MHz clock for high bandwidth
• 2-Word Burst on all accesses
• Double Data Rate (DDR) interfaces on both Read and
• Two input clocks (K and K) for precise DDR timing
• Two input clocks for output data (C and C) to minimize
• Echo clocks (CQ and CQ) simplify data capture in
• Single multiplexed address input bus latches address
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x9, x18, and x36 configurations
• Full data coherency, providing most current data
• Core V
• Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
• Offered in both lead-free and non lead-free packages
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
— Supports concurrent transactions
Write ports (data transferred at 500 MHz) @ 250 MHz
— SRAM uses rising edges only
clock-skew and flight-time mismatches
high-speed systems
inputs for both Read and Write ports
DD
= 1.8V (±0.1V); I/O V
DDQ
= 1.4V to V
198 Champion Court
36-Mbit QDR-II™ SRAM 2-Word Burst
DD
250 MHz
1065
250
Functional Description
The CY7C1410AV18, CY7C1425AV18, CY7C1412AV18, and
CY7C1414AV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array.
The Read port has dedicated Data Outputs to support Read
operations and the Write Port has dedicated Data Inputs to
support Write operations. QDR-II architecture has separate
data inputs and data outputs to completely eliminate the need
to “turn-around” the data bus required with common I/O
devices. Access to each port is accomplished through a
common address bus. The Read address is latched on the
rising edge of the K clock and the Write address is latched on
the rising edge of the K clock. Accesses to the QDR-II Read
and Write ports are completely independent of one another. In
order to maximize data throughput, both Read and Write ports
are equipped with Double Data Rate (DDR) interfaces. Each
address location is associated with two 8-bit words
(CY7C1410AV18) or 9-bit words (CY7C1425AV18) or 18-bit
words (CY7C1412AV18) or 36-bit words (CY7C1414AV18)
that burst sequentially into or out of the device. Since data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K and C and C), memory bandwidth
is maximized while simplifying system design by eliminating
bus “turn-arounds.”
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
San Jose
200 MHz
200
870
,
CA 95134-1709
Revised June 26, 2006
167 MHz
CY7C1410AV18
CY7C1425AV18
CY7C1412AV18
CY7C1414AV18
167
740
Architecture
408-943-2600
Unit
MHz
mA
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Related parts for CY7C1412AV18-167BZC

CY7C1412AV18-167BZC Summary of contents

Page 1

... Double Data Rate (DDR) interfaces. Each address location is associated with two 8-bit words (CY7C1410AV18) or 9-bit words (CY7C1425AV18) or 18-bit words (CY7C1412AV18) or 36-bit words (CY7C1414AV18) that burst sequentially into or out of the device. Since data can be transferred into and out of the device on every rising edge ...

Page 2

... Document #: 38-05615 Rev. *C Write Write Address Reg Reg Register Control Logic Read Data Reg Reg. Reg. 8 Reg. Write Write Address Reg Reg Register Control Logic Read Data Reg. 18 Reg. Reg. 9 Reg. 9 CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 A (20:0) 21 RPS [7: (20:0) 21 RPS [8:0] 9 Page [+] Feedback ...

Page 3

... Logic Block Diagram (CY7C1412AV18) D [17:0] 18 Address Register A (19: CLK K Gen. DOFF V REF WPS Control Logic BWS [1:0] Logic Block Diagram (CY7C1414AV18) D [35:0] 36 Address Register A (18: CLK K Gen. DOFF V REF WPS Control Logic BWS [3:0] Document #: 38-05615 Rev. *C Write Write Address Reg ...

Page 4

... DDQ DDQ CY7C1425AV18 ( WPS NC K NC/144M A NC/288M K BWS DDQ DDQ DDQ DDQ DDQ DDQ DDQ CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 RPS DDQ DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ TMS TDI RPS DDQ DDQ DDQ DDQ DDQ REF DDQ DDQ DDQ V ...

Page 5

... Q30 Q21 D21 D30 G D22 Q22 DOFF REF DDQ J D31 Q31 D23 K Q32 D32 Q23 L Q33 Q24 D24 M D33 Q34 D25 N D34 D26 Q25 P Q35 D35 Q26 R TDO TCK A Document #: 38-05615 Rev. *C CY7C1412AV18 ( WPS BWS K NC/288M BWS DDQ DDQ DD SS ...

Page 6

... Read and Write operations. Internally, the device is organized arrays each for CY7C1410AV18 arrays each for CY7C1425AV18 arrays each 18) for CY7C1412AV18 and arrays each of 512K x 36) for CY7C1414AV18. Therefore, only 21 address inputs are needed to access the entire memory array of CY7C1410AV18 and CY7C1425AV18, 20 address inputs for CY7C1412AV18 and 19 address inputs for CY7C1414AV18 ...

Page 7

... Each access consists of two 8-bit data transfers in the case of CY7C1410AV18, two 9-bit data transfers in the case of CY7C1425AV18,two 18-bit data transfers in the case of CY7C1412AV18 and two 36-bit data transfers in the case of CY7C1414AV18, in one clock cycle. Document #: 38-05615 Rev. *C CY7C1410AV18 ...

Page 8

... Write cycle that was initiated on the previous K clock rise. Depth Expansion The CY7C1412AV18 has a Port Select input for each port. This allows for easy depth expansion. Both Port Selects are sampled on the rising edge of the Positive Input Clock only (K). ...

Page 9

... During the Data portion of a Write sequence: CY7C1410AV18 − both nibbles (D CY7C1412AV18 − both bytes (D [17:0] – During the Data portion of a Write sequence: CY7C1410AV18 − only the lower nibble (D remain unaltered, CY7C1412AV18 − only the lower byte (D remain unaltered. ↑ represents rising edge. , NWS , BWS 0 1 ...

Page 10

... L-H During the Data portion of a Write sequence: CY7C1410AV18 − only the upper nibble (D remain unaltered, CY7C1412AV18 − only the upper byte (D remain unaltered. – No data is written into the devices during this portion of a Write operation. L-H No data is written into the devices during this portion of a Write operation. ...

Page 11

... Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the Document #: 38-05615 Rev. *C CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 TDI and TDO pins as shown in TAP Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section ...

Page 12

... Document #: 38-05615 Rev. *C CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO pins ...

Page 13

... Note: 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document #: 38-05615 Rev SELECT DR-SCAN 0 1 CAPTURE-DR 0 SHIFT- EXIT1- PAUSE- EXIT2-DR 1 UPDATE- CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 1 SELECT IR-SCAN 0 1 CAPTURE-IR 0 SHIFT- EXIT1- PAUSE- EXIT2-IR 1 UPDATE- Page [+] Feedback ...

Page 14

... Boundary Scan Register TAP Controller [15, 18, 10] Over the Operating Range Test Conditions = −2 −100 µ 2 100 µ GND ≤ V ≤ CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 Selection Circuitry TDO Min. Max. Unit 1.4 V 1.6 V 0.4 V 0.2 V 0.65V –0.3 0.35V V DD −5 µA ...

Page 15

... CS CH 12. Test conditions are specified using the load in TAP AC test conditions. t Document #: 38-05615 Rev. *C [11, 12] Over the Operating Range Description [12] 1. TMSS t TMSH t TDIS t TDIH t TDOV / ns CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 Min. Max. Unit MHz ALL INPUT PULSES 0.9V ...

Page 16

... Do Not Use: This instruction is reserved for future use. Do Not Use: This instruction is reserved for future use. Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 CY7C1414AV18 Description 000 Version number. SRAM. ...

Page 17

... Bump ID 10G 11F 58 5A 11G 10F 61 4B 11E 62 3A 10E 63 2A 10D 10C 66 3B 11D 11B 70 3C 11C 10B 73 3E 11A 74 2D 10A CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 Bit # Bump 100 2P 101 1P 102 3R 103 4R 104 4P 105 5P 106 5N 107 5R 108 Internal Page [+] Feedback ...

Page 18

... If the input clock is unstable and the DLL is enabled, then the DLL may lock to an incorrect frequency, causing unstable SRAM behavior REF > 1024 Stable clock Stable DDQ Stable (< +/- 0.1V DC per 50ns ) / DDQ Fix High (or tied to V DDQ ) CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 . Start Normal Operation Page [+] Feedback ...

Page 19

... RQ <= 350Ωs. /2), Undershoot: V (AC) > –1.5V (Pulse width less than t CYC IL (min.) within 200 ms. During this time V < V and (Max.) = 0.95V or 0.54V , whichever is smaller. REF DDQ CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 Ambient [19] [19 DDQ 1.8 ± 0.1V 1. Min. Typ. Max. Unit 1 ...

Page 20

... REF OUTPUT Device 0.25V 5 pF Under ZQ Test RQ = 250Ω (b) /I and load capacitance shown in ( Test Loads CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 165 FBGA Package Unit °C/W 17.2 °C/W 3.2 [22] ALL INPUT PULSES 1.25V 0.75V Slew Rate = 2 V/ns = 1.5V, input DDQ Page [+] Feedback ...

Page 21

... CLZ CHZ CO is the time that the power needs to be supplied above V is 0.5 ns for 200 MHz, and 250 MHz frequencies. SD CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 200 MHz 167 MHz Min. Max. Min. Max. Unit 6.3 5.0 7 ...

Page 22

... Document #: 38-05615 Rev. *C WRITE READ WRITE NOP CYC t KHKH D31 D50 D51 D60 Q00 Q01 Q20 t CQDOH t DOH t CYC t CCQO t CQOH t CCQO CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 WRITE NOP D61 Q21 Q40 Q41 t CHZ t CQD DON’T CARE UNDEFINED Page [+] Feedback ...

Page 23

... Package (MHz) Ordering Code Diagram 167 CY7C1410AV18-167BZC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) CY7C1425AV18-167BZC CY7C1412AV18-167BZC CY7C1414AV18-167BZC CY7C1410AV18-167BZXC 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) Lead-Free CY7C1425AV18-167BZXC CY7C1412AV18-167BZXC CY7C1414AV18-167BZXC CY7C1410AV18-167BZI 51-85195 165-ball Fine Pitch Ball Grid Array ( 1.4 mm) ...

Page 24

... The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. www.cypress.com for actual products offered. Package Type CY7C1410AV18 CY7C1425AV18 CY7C1412AV18 CY7C1414AV18 Operating Range Industrial 51-85195-*A Page ...

Page 25

... Document History Page Document Title: CY7C1410AV18/CY7C1425AV18/CY7C1412AV18/CY7C1414AV18 36-Mbit QDR-II™ SRAM 2-Word Burst Architecture Document Number: 38-05615 REV. ECN No. Issue Date ** 247331 See ECN *A 326519 See ECN *B 413953 See ECN *C 468029 See ECN Document #: 38-05615 Rev. *C Orig. of Change Description of Change SYT New Data Sheet ...

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