NXPS20H100CX,127 NXP Semiconductors, NXPS20H100CX,127 Datasheet
NXPS20H100CX,127
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NXPS20H100CX,127 Summary of contents
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NXPS20H100CX Dual power Schottky diode Rev. 2 — 24 May 2012 1. Product profile 1.1 General description Dual common cathode power Schottky diode designed for high frequency switched mode power supplies in a SOT186A (TO-220F) "full pack" plastic package. 1.2 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 A1 anode cathode 3 A2 anode 2 mb n.c. mb; isolated 3. Ordering information Table 3. Ordering information Type number Package Name NXPS20H100CX TO-220F 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). ...
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... NXP Semiconductors 10 P tot ( 0.2 0 Fig 1. Forward power dissipation as a function of average forward current; square waveform; per diode; maximum values 12 I F(AV Fig 3. Average forward current as a function of heatsink temperature; per diode; maximum values NXPS20H100CX Product data sheet 003aaj311 δ ...
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... NXP Semiconductors 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-h) heatsink R thermal resistance from junction to th(j-a) ambient 10 Z th(j-h) (K/ Fig 5. Transient thermal impedance from junction to heatsink as a function of pulse width; per diode 6. Isolation characteristics Table 6. ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter Static characteristics V forward voltage F I reverse current R Dynamic characteristics C diode capacitance ( ( 0.2 0.4 Fig 6. Forward current as a function of forward voltage; per diode NXPS20H100CX Product data sheet Conditions °C; see ...
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... NXP Semiconductors Fig 8. Junction capacitance as a function of applied reverse voltage; per diode; typical values NXPS20H100CX Product data sheet 1000 C (pF) 100 1 10 All information provided in this document is subject to legal disclaimers. Rev. 2 — 24 May 2012 NXPS20H100CX Dual power Schottky diode 003aaj349 100 ...
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... NXP Semiconductors 8. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3-lead TO-220 'full pack DIMENSIONS (mm are the original dimensions UNIT 4.6 2.9 0.9 1.1 1.4 mm 4.0 2.5 0.7 0.9 1.0 Notes 1. Terminal dimensions within this zone are uncontrolled. 2. Both recesses are ∅ 2.5 × 0.8 max. depth ...
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... NXP Semiconductors 9. Revision history Table 8. Revision history Document ID Release date NXPS20H100CX v.2 20120524 • Modifications: Status changed from preliminary to product. • Various changes to content. NXPS20H100CX v.1 20120420 NXPS20H100CX Product data sheet Data sheet status Change notice Product data sheet - Preliminary data sheet - All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 12. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .4 6 Isolation characteristics . . . . . . . . . . . . . . . . . . .4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8 10 Legal information 10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9 10 ...