BUK9Y30-75B T/R NXP Semiconductors, BUK9Y30-75B T/R Datasheet - Page 3

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BUK9Y30-75B T/R

Manufacturer Part Number
BUK9Y30-75B T/R
Description
MOSFET TRENCH 31V-99V G3
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9Y30-75B T/R

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
75 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
34 A
Resistance Drain-source Rds (on)
0.028 Ohms
Configuration
Single Triple Source
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-669
Fall Time
83 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
85 W
Rise Time
106 ns
Factory Pack Quantity
1500
Typical Turn-off Delay Time
51 ns
Part # Aliases
BUK9Y30-75B,115
NXP Semiconductors
BUK9Y30-75B_4
Product data sheet
Fig 1. Normalized continuous drain current as a
Fig 3. Single-shot and repetitive avalanche rating; avalanche current as a function of avalanche period
(A)
40
30
20
10
I
D
0
V
function of mounting base temperature
(1) Single pulse;T
(2) Single pulse;T
(3) Repetitive.
GS
0
5V
50
j
j
= 25 °C.
= 150 °C.
100
10
10
I
(A)
10
AV
150
-1
2
1
10
-3
T
mb
03no16
(°C)
200
10
Rev. 04 — 10 April 2008
-2
10
-1
Fig 2. Normalized total power dissipation as a
(1)
(2)
(3)
P
(%)
der
120
80
40
0
1
P
function of mounting base temperature
0
der
t
AV
03np81
(ms)
=
P
N-channel TrenchMOS logic level FET
tot ( 25°C )
10
P
50
tot
× 100 %
BUK9Y30-75B
100
150
© NXP B.V. 2008. All rights reserved.
T
mb
03na19
(°C)
200
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