SPZB32W1C2.1 STMicroelectronics, SPZB32W1C2.1 Datasheet - Page 14
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
SPZB32W1C2.1
Manufacturer Part Number
SPZB32W1C2.1
Description
Zigbee / 802.15.4 Modules Zigbee PRO Module STM32W Chipset
Manufacturer
STMicroelectronics
Datasheet
1.SPZB32W1C2.1.pdf
(19 pages)
Specifications of SPZB32W1C2.1
Product Category
Zigbee / 802.15.4 Modules
Frequency Band
2.4 GHz
Sensitivity
- 95 dBm
Operating Supply Voltage
3.3 V
Supply Current Transmitting
32 mA
Supply Current Receiving
28 mA
Output Power
6 dBm
Antenna Connector Type
U.FL
Maximum Operating Temperature
+ 85 C
Dimensions
26.5 mm x 16.4 mm x 3.9 mm
Interface Type
I2C, UART
Minimum Operating Temperature
- 40 C
Soldering
8
14/19
Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations
Table 7.
Figure 6.
Average ramp up rate (T
Temperature min. (T
Temperature max. (T
Time (T
Temperature T
Time t
Peak temperature (T
Time within 5 °C of actual peak temperature (t
Ramp down rate
Time from 25 °C to peak temperature
L
S MIN
Time maintained above:
to T
Soldering
Soldering profile
L
S MAX
Profile feature
Preheat
S MIN
p
S MAX
)
) (t
SMAX
)
S
)
)
to T
Doc ID 018899 Rev 2
P
)
P
)
PB free assembly
3 °C / sec max.
8 minutes max.
60 – 100 sec
40 – 70 sec
10 – 20 sec
240 + 0 °C
6 °C / sec
150 °C
200 °C
217 °C
SPZB32W1x2.1