PBSS9110D T/R NXP Semiconductors, PBSS9110D T/R Datasheet
PBSS9110D T/R
Specifications of PBSS9110D T/R
Related parts for PBSS9110D T/R
PBSS9110D T/R Summary of contents
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... Features Low collector-emitter saturation voltage V High collector current capability I High collector current gain (h High efficiency due to less heat generation Smaller required Printed-Circuit Board (PCB) area than for conventional transistors 1.3 Applications High-voltage DC-to-DC conversion High-voltage MOSFET gate driving High-voltage motor control High-voltage power switches (e.g. motors, fans) Automotive applications 1 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS9110D 4. Marking Table 4. Type number PBSS9110D 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1cm ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) 1 0.75 (K/W) 0.5 0. 0.2 0.1 0.05 10 0.02 0. −1 10 −5 − FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values duty cycle = th(j-a) (K/W) 1 0.75 2 0.5 10 0.33 0.2 0.1 0.05 10 0.02 0. −1 10 −5 − FR4 PCB, mounting pad for collector 1cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration ...
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... NXP Semiconductors 7. Characteristics Table 7. ° amb Symbol Parameter I collector-base cut-off CBO current I collector-emitter cut-off CES current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R collector-emitter CEsat saturation resistance V base-emitter saturation BEsat voltage V base-emitter turn-on BEon voltage ...
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... NXP Semiconductors 600 ( 400 (2) (3) 200 0 −1 −10 −1 −10 −10 = − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 4. DC current gain as a function of collector current; typical values −1 (V) (1) −0.8 (2) (3) −0.4 0 − ...
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... NXP Semiconductors −1 V CEsat (V) −1 −10 (1) (2) (3) −2 −10 −1 −10 −1 −10 − 100 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values CEsat (Ω ...
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... NXP Semiconductors 8. Test information − − Fig 12. BISS transistor switching time definition V Fig 13. Test circuit for switching times PBSS9110D_3 Product data sheet (probe) oscilloscope 450 Ω − −0 −0.025 A; I ...
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... NXP Semiconductors 9. Package outline Fig 14. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PBSS9110D [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering 3.30 Dimensions in mm Fig 15. Reflow soldering footprint SOT457 (SC-74) 5.05 Dimensions in mm Fig 16. Wave soldering footprint SOT457 (SC-74) PBSS9110D_3 Product data sheet 100 PNP low V 3.45 1.95 0.95 2.825 1.60 1.70 3.10 3.20 5.30 1.40 4.30 Rev. 03 — 22 November 2009 PBSS9110D (BISS) transistor CEsat solder lands solder resist 0.45 0.55 occupied area solder paste ...
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... Revision history Document ID Release date PBSS9110D_3 20091122 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Figure 16 “Wave soldering footprint SOT457 PBSS9110D_2 20060713 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Legal information ...