PBSS4480X /T3 NXP Semiconductors, PBSS4480X /T3 Datasheet

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PBSS4480X /T3

Manufacturer Part Number
PBSS4480X /T3
Description
Transistors Bipolar - BJT NPN 80V 4A
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PBSS4480X /T3

Product Category
Transistors Bipolar - BJT
Rohs
yes
Configuration
Single
Transistor Polarity
NPN
Collector- Base Voltage Vcbo
80 V
Collector- Emitter Voltage Vceo Max
80 V
Emitter- Base Voltage Vebo
5 V
Collector-emitter Saturation Voltage
5 V
Gain Bandwidth Product Ft
150 MHz
Dc Collector/base Gain Hfe Min
250 at 0.5 A at 2 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Package / Case
SOT-89
Continuous Collector Current
4 A
Maximum Power Dissipation
2500 mW
Minimum Operating Temperature
- 65 C
Factory Pack Quantity
4000
Part # Aliases
PBSS4480X,135
Product data sheet
Supersedes data of 2004 Aug 5
book, halfpage
DATA SHEET
PBSS4480X
80 V, 4 A
NPN low V
DISCRETE SEMICONDUCTORS
M3D109
CEsat
(BISS) transistor
2004 Oct 25

Related parts for PBSS4480X /T3

PBSS4480X /T3 Summary of contents

Page 1

DATA SHEET book, halfpage PBSS4480X NPN low V Product data sheet Supersedes data of 2004 Aug 5 DISCRETE SEMICONDUCTORS M3D109 (BISS) transistor CEsat 2004 Oct 25 ...

Page 2

... NXP Semiconductors NPN low V (BISS) transistor CEsat FEATURES • High h and low V at high current operation FE CEsat • High collector current capability: I • High efficiency leading to less heat generation. APPLICATIONS • Medium power peripheral drivers; e.g. fan, motor • Strobe flash units for DSC and mobile phones • ...

Page 3

... NXP Semiconductors NPN low V (BISS) transistor CEsat LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER V collector-base voltage CBO V collector-emitter voltage CEO V emitter-base voltage EBO I collector current (DC repetitive peak collector current CRM I peak collector current ...

Page 4

... NXP Semiconductors NPN low V (BISS) transistor CEsat 1600 P (1) tot (mW) 1200 (2) 800 (3) 400 0 − 100 2 (1) FR4 PCB mounting pad for collector. 2 (2) FR4 PCB mounting pad for collector. (3) FR4; standard footprint. Fig.2 Power derating curves. ...

Page 5

... NXP Semiconductors NPN low V (BISS) transistor CEsat THERMAL CHARACTERISTICS SYMBOL PARAMETER R thermal resistance from junction th(j-a) to ambient R thermal resistance from junction th(j-s) to soldering point Notes 1. Operated under pulsed conditions; pulse width t 2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint. ...

Page 6

... NXP Semiconductors NPN low V (BISS) transistor CEsat (K/W) ( (2) (3) (4) (5) (6) 10 (7) (8) (9) 1 (10) −1 10 −5 − Mounted on FR4 printed-circuit board; mounting pad for collector 1 cm (1) δ (3) δ = 0.5. (2) δ = 0.75. (4) δ = 0.33. Fig.4 Transient thermal impedance as a function of pulse time; typical values. ...

Page 7

... NXP Semiconductors NPN low V (BISS) transistor CEsat CHARACTERISTICS = 25 °C unless otherwise specified. T amb SYMBOL PARAMETER I collector-base cut-off current CBO I collector-emitter cut-off current CES I emitter-base cut-off current EBO h DC current gain FE V collector-emitter saturation CEsat voltage R equivalent on-resistance CEsat V base-emitter saturation voltage ...

Page 8

... NXP Semiconductors NPN low V (BISS) transistor CEsat 1000 h FE (1) 800 (2) 600 400 (3) 200 0 − 100 °C. (1) T amb = 25 °C. (2) T amb = −55 °C. (3) T amb Fig.6 DC current gain as a function of collector current; typical values ...

Page 9

... NXP Semiconductors NPN low V (BISS) transistor CEsat 1.2 V BEsat (V) (1) 0.8 (2) (3) 0.4 0 − 20 −55 °C. (1) T amb = 25 °C. (2) T amb = 100 °C. (3) T amb Fig.10 Base-emitter saturation voltage as a function of collector current; typical values. 10 (4) (3) (2) ( ...

Page 10

... NXP Semiconductors NPN low V (BISS) transistor CEsat Reference mounting conditions 2.5 mm 0.5 mm 3.96 mm Fig.14 FR4, standard footprint 2.5 mm 0.5 mm 3.96 mm 001aaa235 Fig.16 FR4, mounting pad for collector 6 cm 2004 Oct 25 handbook, halfpage 1.6 mm 001aaa234 ...

Page 11

... NXP Semiconductors NPN low V (BISS) transistor CEsat PACKAGE OUTLINE Plastic surface-mounted package; collector pad for good heat transfer; 3 leads w M DIMENSIONS (mm are the original dimensions) UNIT 1.6 0.48 0.53 1.8 mm 1.4 0.35 0.40 1.4 OUTLINE VERSION IEC SOT89 2004 Oct ...

Page 12

... NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. ...

Page 13

... NXP Semiconductors Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Contact information For additional information please visit: http://www ...

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