PBSS4420D T/R NXP Semiconductors, PBSS4420D T/R Datasheet
PBSS4420D T/R
Specifications of PBSS4420D T/R
Related parts for PBSS4420D T/R
PBSS4420D T/R Summary of contents
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PBSS4420D NPN low V Rev. 02 — 24 September 2008 1. Product profile 1.1 General description NPN low V SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package. PNP complement: PBSS5420D. 1.2 Features I Very low collector-emitter saturation ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBSS4420D 4. Marking Table 4. Type number PBSS4420D 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg [1] Device mounted on a ceramic PCB, Al [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm ...
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... NXP Semiconductors th(j-a) duty cycle = (K/ 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, mounting pad for collector 1 cm Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0. FR4 PCB, mounting pad for collector 6 cm Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CES I EBO CEsat R CEsat V BEsat V BEon off [1] Pulse test: t PBSS4420D_2 Product data sheet Characteristics Parameter Conditions collector-base cut-off ...
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... NXP Semiconductors 1000 h FE 800 (1) 600 (2) 400 (3) 200 ( 100 C amb ( amb ( amb Fig 5. DC current gain as a function of collector current; typical values 1 (V) 1.2 1.0 (1) 0.8 (2) 0.6 (3) 0.4 0 (1) T ...
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... NXP Semiconductors 10 V CEsat (V) 1.0 ( 100 C amb ( amb ( amb Fig 9. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ...
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... NXP Semiconductors 8. Test information Fig 13. BISS transistor switching time definition oscilloscope Bon Fig 14. Test circuit for switching times PBSS4420D_2 Product data sheet (probe) 450 R2 V DUT ...
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... NXP Semiconductors 9. Package outline Fig 15. Package outline SOT457 (SC-74) 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description PBSS4420D [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping ...
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... NXP Semiconductors 11. Soldering 3.3 Fig 16. Reflow soldering footprint SOT457 (SC-74) 1.475 5.05 1.475 Fig 17. Wave soldering footprint SOT457 (SC-74) PBSS4420D_2 Product data sheet 3.45 1.95 0.95 2.825 0. 2.4 5.3 1. 2.85 Rev. 02 — 24 September 2008 PBSS4420D NPN low V (BISS) transistor CEsat 0.55 solder lands 0. solder resist solder paste ...
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... Document ID Release date PBSS4420D_2 20080924 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Figure • Section 11 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Revision history ...