PBSS5350D /T3 NXP Semiconductors, PBSS5350D /T3 Datasheet
PBSS5350D /T3
Specifications of PBSS5350D /T3
Related parts for PBSS5350D /T3
PBSS5350D /T3 Summary of contents
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... CEsat Conditions open base -200 mA; pulsed ≤ 300 µs; δ ≤ 0. °C p amb Product data sheet AEC-Q101 qualified Smaller Printed-Circuit Board (PCB) area than for conventional transistors DC-to-DC conversion Min Typ Max - - - 120 150 ...
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... NXP Semiconductors 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 C collector 2 C collector 3 B base 4 E emitter 5 C collector 6 C collector 3. Ordering information Table 3. Ordering information Type number Package Name PBSS5350D TSOP6 4. Marking Table 4. Marking codes Type number PBSS5350D PBSS5350D ...
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... NXP Semiconductors 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V collector-base voltage CBO V collector-emitter voltage CEO V emitter-base voltage EBO I collector current C I peak collector current CM I peak base current BM P total power dissipation ...
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... NXP Semiconductors 7. Characteristics Table 7. Characteristics Symbol Parameter I collector-base cut-off CBO current I emitter-base cut-off EBO current h DC current gain FE V collector-emitter CEsat saturation voltage R collector-emitter CEsat saturation resistance V base-emitter saturation BEsat voltage V base-emitter turn-on BEon voltage f transition frequency T C collector capacitance c PBSS5350D ...
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... NXP Semiconductors 1000 h FE 800 (1) 600 (2) 400 (3) 200 0 −1 −10 −1 − ( 150 °C amb ( °C amb ( -55 °C amb Fig 1. DC current gain as a function of collector current; typical values –5 I (mA) = –250 –225 (A) –200 –4 – ...
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... NXP Semiconductors −1.4 V BEsat (V) −1.2 −1.0 (1) −0.8 (2) −0.6 (3) −0.4 −0.2 −1 −10 −1 − ( -55 °C amb ( °C amb ( 150 °C amb Fig 5. Base-emitter saturation voltage as a function of collector current; typical values ( 150 °C ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package (TSOP6); 6 leads y 6 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) UNIT 0.1 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT457 Fig 8. Package outline SOT457 (TSOP6) PBSS5350D Product data sheet ...
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... NXP Semiconductors 9. Soldering 0.95 3.3 2.825 0.95 Fig 9. Reflow soldering footprint for SOT457 (TSOP6) 1.475 5.05 1.475 Fig 10. Wave soldering footprint for SOT457 (TSOP6) PBSS5350D Product data sheet 3.45 1.95 0.45 (6×) 0.7 (6×) 0.8 (6×) 2.4 5.3 1.45 (6×) 2.85 All information provided in this document is subject to legal disclaimers. Rev. 6 — 28 June 2011 PBSS5350D PNP low VCEsat (BISS) transistor 0 ...
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... NXP Semiconductors 10. Revision history Table 8. Revision history Document ID Release date PBSS5350D v.6 20110628 • Modifications: 5 “Limiting PBSS5350D v.5 20110323 PBSS5350D v.4 20011113 PBSS5350D v.3 20010713 PBSS5350D v.2 20010126 PBSS5350D v.1 20000308 PBSS5350D Product data sheet PNP low VCEsat (BISS) transistor Data sheet status Product data sheet values” ...
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... NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 General description . . . . . . . . . . . . . . . . . . . . . .1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . .3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .4 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .9 11 Legal information .10 11 ...