MT46H8M16LFCF-10 Micron Technology Inc, MT46H8M16LFCF-10 Datasheet

IC DDR SDRAM 128MBIT 60VFBGA

MT46H8M16LFCF-10

Manufacturer Part Number
MT46H8M16LFCF-10
Description
IC DDR SDRAM 128MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheets

Specifications of MT46H8M16LFCF-10

Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
60-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H8M16LFCF-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Mobile DDR SDRAM
MT46H8M16LF – 2 Meg x 16 x 4 Banks
For the latest data sheet, refer to Micron’s Web site:
Features
• V
• Bidirectional data strobe per byte of data (DQS)
• Internal, pipelined double data rate (DDR)
• Differential clock inputs (CK and CK#)
• Commands entered on each positive CK edge
• DQS edge-aligned with data for READs; center-
• Four internal banks for concurrent operation
• Data masks (DM) for masking write data–one mask
• Programmable burst lengths: 2, 4, or 8
• Concurrent auto precharge option is supported
• Auto refresh and self refresh modes
• 1.8V LVCMOS-compatible inputs
• On-chip temperature sensor to control refresh rate
• Partial-array self refresh (PASR)
• Selectable output drive (DS)
• Clock stop capability
Options
• V
• Configuration
• Plastic package
• Timing – cycle time
• Operating temperature range
• Design revision
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_1.fm - Rev. A 5/06 EN
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
architecture; two data accesses per clock cycle
aligned with data for WRITEs
per byte
– 1.8V/1.8V
– 8 Meg x 16 (2 Meg x 16 x 4 banks)
– 60-Ball VFBGA (lead-free)
– 7.5ns @ CL = 3
– 10ns @ CL = 3
– Commercial (0° to +70°C)
– Industrial (–40°C to +85°C)
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
DD
DD
8mm x 10mm
/V
= +1.8 ±0.1V, V
DD
Q
DD
Q = +1.8 ±0.1V
Marking
8M16
None
-75
-10
CF
IT
:B
H
www.micron.com/mobile
1
Figure 1:
Table 1:
Table 2:
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
Speed
Grade
A
B
C
D
E
F
G
H
J
K
-75
-10
-75
-10
128Mb: 8 Meg x 16 Mobile DDR SDRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
V
V
V
V
Architecture
CKE
V
V
V
DD
DD
A9
A6
1
SS
SS
SS
SS
SS
Q
Q
Q
Q
133 MHz
104 MHz
CL = 3
UDQS
DQ15
DQ13
DQ11
UDM
DQ9
A11
Clock Rate
CK
A7
A4
2
Configuration Addressing
Key Timing Parameters
60-Ball VFBGA Assignment
(Top View)
DQ14
DQ12
DQ10
V
DQ8
CK#
NC
NC
A8
A5
3
SS
Q
83 MHz
67 MHz
CL = 2
4
Window
5
©2006 Micron Technology, Inc. All rights reserved.
4.65ns
Data-
2.4ns
3.1ns
5.8ns
Out
6
2 Meg x 16 x 4
4K (A0–A11)
4 (BA0, BA1)
8 Meg x 16
1K (A0–A8)
A10/AP
V
WE#
DQ1
DQ3
DQ5
DQ7
CS#
DD
NC
A2
Access
7
Time
6.0ns
7.0ns
6.5ns
7.0ns
Q
4K
LDQS
CAS#
DQ0
DQ2
DQ4
DQ6
LDM
BA0
Features
A0
A3
8
Advance ‡
V
V
Skew
V
V
RAS#
DQS-
V
V
BA1
V
0.6ns
0.7ns
0.6ns
0.7ns
DD
DD
A1
SS
SS
9
DD
DD
DD
DQ
Q
Q
Q
Q

Related parts for MT46H8M16LFCF-10

MT46H8M16LFCF-10 Summary of contents

Page 1

Mobile DDR SDRAM MT46H8M16LF – 2 Meg Banks For the latest data sheet, refer to Micron’s Web site: Features • +1.8 ±0.1V +1.8 ±0. • Bidirectional data strobe per ...

Page 2

Table of Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 3

List of Figures Figure 1: 60-Ball VFBGA Assignment (Top View ...

Page 4

List of Tables Table 1: Configuration Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 5

... Part Number MT46H8M16LFCF-75:B MT46H8M16LFCF-75IT:B MT46H8M16LFCF-10:B MT46H8M16LFCF-10IT:B FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Micron’s new FBGA Part Marking Decoder makes it easier to understand this part marking. Visit the Web site at www ...

Page 6

... REGISTER 2 9 PDF: 09005aef822b7e27/Source: 09005aef822b7dd6 MT46H8M16LFB_2.fm - Rev. A 5/06 EN 128Mb: 8 Meg x 16 Mobile DDR SDRAM BANK3 BANK2 BANK1 12 BANK0 13 ROW- BANK0 ADDRESS MEMORY 4,096 LATCH ARRAY & (4,096 x 256 x 32) DECODER SENSE AMPLIFIERS 8,192 I/O GATING DM MASK LOGIC BANK CONTROL LOGIC 256 ...

Page 7

... Address inputs: Provide the row address for ACTIVE commands, and the column address and auto precharge bit (A10) for READ or WRITE commands, to select one location out of the memory array in the respective bank. During a PRECHARGE command, A10 determines whether the PRECHARGE applies to one bank (A10 LOW, bank selected by BA0, BA1) or all banks (A10 HIGH) ...

Page 8

... Functional Description The 128Mb Mobile DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing 134,217,728-bits internally configured as a quad-bank DRAM. Each of the 33,554,432-bit banks is organized as 4,096 rows by 512 columns by 16 bits. The 128Mb Mobile DDR SDRAM uses a double data rate architecture to achieve high- speed operation ...

Page 9

... LOAD MODE REGISTER SET command (with BA0 = 0 and BA1 = 0) and will retain the stored information until it is programmed again. Reprogramming the standard mode register will not alter the contents of the memory, provided it is performed correctly. The mode register must be loaded (reloaded) when all banks are idle and no bursts are in progress, and the controller must wait the speci- fied time before initiating the subsequent operation ...

Page 10

Burst Type Accesses within a given burst may be programmed to be either sequential or interleaved; this is referred to as the burst type and is selected via bit M3. The ordering of accesses within a burst is determined by ...

Page 11

Table 5: Burst Definition Burst Length Notes: 1. For A1–Ai select the two-data-element block; A0 selects the first access within the block. 2. For A2–Ai select the four-data-element block; A0–A1 select ...

Page 12

Figure 4: CAS Latency CK# COMMAND DQS DQ CK# COMMAND DQS DQ Notes the cases shown. 2. Shown with nominal Operating Mode The normal operating mode is selected by issuing a LOAD MODE REGISTER SET ...

Page 13

... Because the Mobile DDR SDRAM is designed for use in smaller systems that are mostly point to point, an option to control the drive strength of the output buffers is available. Drive strength should be selected based on the expected loading of the memory bus. Bits A5 and A6 of the extended mode register can be used to select the driver strength of the DQ outputs ...

Page 14

Stopping the External Clock One method of controlling the power efficiency in applications is to throttle the clock which controls the SDRAM. There are two basic ways to control the clock: 1. Change the clock frequency, when the data transfers ...

Page 15

Commands Table 7 and Table 8 provide quick references of available commands. This is followed by a written description of each command. Three additional Truth Tables (Table 9 on page 42, Table 10 on page 43, and Table 11 on ...

Page 16

... WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. Input data appearing on the DQs is written to the memory array subject to the DM input logic level appearing coinci- dent with the data given DM signal is registered LOW, the corresponding data will be written to memory ...

Page 17

READ or WRITE command to a different bank is allowed as long as it does not interrupt the data transfer in the current bank and does not violate any other timing parameters. Input A10 determines ...

Page 18

AUTO REFRESH command except CKE is disabled (LOW). All command and address input signals except CKE are “Don’t Care” during SELF REFRESH. During SELF REFRESH, the device is refreshed as identified in the external mode ...

Page 19

Operations Bank/row Activation Before any READ or WRITE commands can be issued to a bank within the Mobile DDR SDRAM, a row in that bank must be “opened.” This is accomplished via the ACTIVE command, which selects both the bank ...

Page 20

Figure 8: Example: Meeting T0 T1 CK# CK COMMAND ACT NOP A0–A11 Row BA0, BA1 Bank x READs READ bursts are initiated with a READ command, as shown in Figure 9 on page 21. The starting column and bank addresses ...

Page 21

Figure 9: READ Command CK# CK CKE CS# RAS# CAS# WE# A0–A8 A11 A10 BA0,1 Notes: 1. DIS AP = Disable auto precharge Enable auto precharge BA = Bank address CA = Column address PDF: 09005aef822b7e27/Source: 09005aef822b7dd6 ...

Page 22

Figure 10: READ Burst CK# COMMAND ADDRESS DQS DQ CK# COMMAND ADDRESS DQS DQ Notes OUT Shown with nominal PDF: 09005aef822b7e27/Source: 09005aef822b7dd6 MT46H8M16LFB_2.fm - Rev. A 5/06 EN 128Mb: 8 Meg x 16 ...

Page 23

Figure 11: Consecutive READ Bursts CK# COMMAND ADDRESS DQS DQ CK# COMMAND COMMAND ADDRESS ADDRESS DQS DQ Notes OUT the cases shown (applies for bursts well). 3. Shown with nominal ...

Page 24

Figure 12: Nonconsecutive READ Bursts CK# CK COMMAND ADDRESS DQS DQ CK# CK COMMAND ADDRESS DQS DQ Notes OUT the cases shown (applies for bursts well). 3. Shown with nominal ...

Page 25

Figure 13: Random READ Accesses CK# CK COMMAND ADDRESS DQS DQ CK# CK COMMAND COMMAND ADDRESS ADDRESS DQS DQ Notes OUT the cases shown (applies for bursts well). 3. READs ...

Page 26

Figure 14: Terminating a READ Burst CK# COMMAND ADDRESS DQS CK# COMMAND ADDRESS DQS Notes OUT 2. Only valid for and Shown with nominal 4. BST = BURST TERMINATE command; page ...

Page 27

Figure 15: READ-to-WRITE CK# COMMAND ADDRESS DQS DQ DM CK# COMMAND ADDRESS DQS DQ DM Notes OUT the cases shown (applies for bursts well ...

Page 28

Figure 16: READ-to-PRECHARGE CK# COMMAND ADDRESS DQS CK# COMMAND ADDRESS DQS Notes OUT interrupted burst Shown with nominal 4. READ-to-PRECHARGE equals 2 clocks, which allows 2 data pairs of ...

Page 29

WRITEs WRITE bursts are initiated with a WRITE command, as shown in Figure 17 on page 30. The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access. ...

Page 30

Figure 17: WRITE Command CK# CK CKE CS# RAS# CAS# WE# A0–A8 A11 A10 BA0,1 Notes: 1. DIS AP = Disable auto precharge Enable auto precharge BA = Bank address CA = Column address PDF: 09005aef822b7e27/Source: 09005aef822b7dd6 ...

Page 31

Figure 18: WRITE Burst CK# COMMAND ADDRESS t DQSS (NOM) DQS DQSS (MIN) DQS DQSS (MAX) DQS DQ DM Notes uninterrupted burst shown. 3. A10 is ...

Page 32

Figure 19: Consecutive WRITE-to-WRITE COMMAND ADDRESS t DQSS (NOM) Notes uninterrupted burst shown. 3. Each WRITE command may be to any bank. Figure 20: Nonconsecutive WRITE-to-WRITE COMMAND ADDRESS t DQSS (NOM) Notes: ...

Page 33

Figure 21: Random WRITE Cycles CK# COMMAND ADDRESS DQS DQ DM Notes ( the next data-in following D burst order. 3. Programmed cases ...

Page 34

Figure 22: WRITE-to-READ – Uninterrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS DQSS (MAX) DQS DQ DM Notes: ...

Page 35

Figure 23: WRITE-to-READ – Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS DQS DQ DM ...

Page 36

Figure 24: WRITE-to-READ – Odd Number of Data, Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) ...

Page 37

Figure 25: WRITE-to-PRECHARGE – Uninterrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS DQS DQ DM Notes: ...

Page 38

Figure 26: WRITE-to-PRECHARGE – Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS DQS DQ DM Notes: ...

Page 39

Figure 27: WRITE-to-PRECHARGE – Odd Number of Data, Interrupting T0 CK# CK COMMAND WRITE Bank a, ADDRESS Col DQSS (NOM) DQSS DQS DQSS (MIN) DQSS DQS DQSS (MAX) DQSS ...

Page 40

PRECHARGE The PRECHARGE command (see Figure 28) is used to deactivate the open row in a particular bank or the open row in all banks. The bank(s) will be available for a subse- quent row access some specified time ( ...

Page 41

Power-Down (Active or Precharge) Power-down (see Figure 30) is entered when CKE is registered LOW. If power-down occurs when all banks are idle, this mode is referred to as precharge power-down; if power-down occurs when there is a row active ...

Page 42

Figure 30: Power-Down (Active or Precharge Referencing CKE and XP CKE COMMAND VALID t Referencing PDEX CKE COMMAND VALID No READ/WRITE access in progress Notes: 1. Clock must toggle a minimum of once during this ...

Page 43

Table 10: Truth Table – Current State Bank n - Command to Bank n Notes: 1–6; notes appear below and on next page Current State CS# RAS# Any Idle Row ...

Page 44

The following states must not be interrupted by any executable command; DESELECT or NOP commands must be applied on each positive clock edge during these states. 6. All states and sequences not shown are illegal or reserved. 7. Not ...

Page 45

Table 11: Truth Table – Current State Bank n - Command to Bank m Notes: 1–6; notes appear below and on next page Current State CS# RAS# Any Idle X X Row L L activating, L ...

Page 46

WR ends, with period starts with registration of the command and ends where the precharge period (or This device supports concurrent auto precharge such that when a read with auto precharge enabled or a write with auto precharge is ...

Page 47

Electrical Specifications Stresses greater than those listed in Table 12 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the ...

Page 48

Table 14: Capacitance Notes: 13; notes appear on pages 52–54 Parameter Delta input/output capacitance: DQs, DQS, DM Delta input capacitance: Command and address Delta input capacitance: CK, CK# Input/output capacitance: DQs, DQS, DM Input capacitance: Address Input capacitance: Command Input ...

Page 49

Table 15: I Specifications and Conditions (continued) DD Notes: 1–5, 7, 10, 12, 14 notes appear on pages 52–54; V Parameter/Condition Operating burst write: One bank active Continuous WRITE bursts; Address inputs are switching; 50 percent data ...

Page 50

Table 16: Electrical Characteristics and Recommended AC Operating Conditions Notes: 1–6, 27; notes appear on pages 52–54 Characteristics Parameter Access window of DQs from CK/CK# CK high-level width CK low-level width Clock cycle time Auto precharge write recovery ...

Page 51

Table 16: Electrical Characteristics and Recommended AC Operating Conditions (continued) Notes: 1–6, 27; notes appear on pages 52–54 Characteristics Parameter DQS write preamble DQS write preamble setup time DQS write postamble Write recovery time Internal WRITE to READ ...

Page 52

Notes 1. All voltages referenced to Vss. 2. All parameters assume proper device initialization. 3. Tests for AC timing nominal reference/supply voltage levels, but the related specifications and device operation are guaranteed for the full voltage range specified. ...

Page 53

HZ and tions. These parameters are not referenced to a specific voltage level, but specify when the device output is no longer driving (HZ) or begins driving (LZ). 16. The maximum limit for this parameter is not a ...

Page 54

V IH can not be greater than 1/3 of the cycle rate. V pulse width ≤ 3ns and the pulse width can not be greater than 1/3 of the cycle rate. t 34. HZ (MAX) will prevail over 35. ...

Page 55

Timing Diagrams Figure 32: x16 Data Output Timing – CK# CK LDQS DQ (Last data valid (First data no longer valid) DQ (Last data valid) DQ (First data no longer valid) DQ0 - ...

Page 56

Figure 33: Data Output Timing – T0 CK# CK COMMAND READ 1 DQS, or LDQS/UDQS 2 All DQ values, collectively Notes transitioning after DQS transition define 2. All DQ must transition the DQ ...

Page 57

Figure 35: Initialize and Load Mode Registers ( ( ) ) CK LVCMOS HIGH LEVEL ( ( ) ) CKE ( ( ...

Page 58

Figure 36: Power-Down Mode (Active or Precharge CKE VALID 1 COMMAND ADDR VALID DQS DQ DM Power-Down Notes this command is ...

Page 59

Figure 37: Auto Refresh Mode CKE NOP 2 COMMAND PRE A0–A9, 1 A11, A11 ALL BANKS 1 A10 ONE BANK Bank(s) ...

Page 60

Figure 38: Self Refresh Mode CK# CKE COMMAND ADDR DQS DM Notes: 1. Clock must be stable before exiting self refresh mode. That is, the clock must be cycling within specifications by Ta0. 2. Device must be in the all ...

Page 61

Figure 39: Bank Read – Without Auto Precharge CKE NOP 6 COMMAND ACT A0– A11, A12 A10 RA t ...

Page 62

Figure 40: Bank Read – With Auto Precharge CKE NOP 6 COMMAND ACT A0– A11, A12 A10 RA t ...

Page 63

Figure 41: Bank Write – Without Auto Precharge CKE NOP 6 COMMAND ACT A0- A11 A10 ...

Page 64

Figure 42: Bank Write – With Auto Precharge CKE NOP 5 COMMAND ACT A0- A11 A10 ...

Page 65

Figure 43: Write – DM Operation CKE NOP 6 COMMAND ACT A0–A9 A11 RA A10 ...

Page 66

Package Dimensions Figure 44: 60-Ball VFBGA Package SEATING PLANE C 0.10 C 60X Ø 0.45 6.40 SOLDER BALL DIAMETER REFERS 0.80 TYP TO POST REFLOW CONDITION. THE PRE- REFLOW DIAMETER IS Ø 0.42 BALL A9 7.20 3.60 3.20 8.00 ±0.10 ...

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