NAND01GW3B2BZA6E NUMONYX, NAND01GW3B2BZA6E Datasheet - Page 44

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NAND01GW3B2BZA6E

Manufacturer Part Number
NAND01GW3B2BZA6E
Description
IC FLASH 1GBIT 63VFBGA
Manufacturer
NUMONYX
Datasheets

Specifications of NAND01GW3B2BZA6E

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
1G (128M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
63-VFBGA
Cell Type
NAND
Density
1Gb
Access Time (max)
25us
Interface Type
Parallel
Boot Type
Not Required
Address Bus
8b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
128M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
NUMONYXST
Quantity:
10 000
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
ST
0
Company:
Part Number:
NAND01GW3B2BZA6E
Quantity:
80
DC and AC parameters
Table 22.
1. Leakage current and standby current double in stacked devices.
Table 23.
1. Leakage current and standby current double in stacked devices.
44/61
I
Symbol
I
Symbol
OL
OL
V
I
I
I
I
I
V
V
V
V
I
I
I
I
V
DD1
DD2
DD3
DD4
DD5
I
V
V
V
I
DD1
DD2
DD3
DD5
I
V
LKO
LO
OH
I
LKO
LI
OL
(RB)
LO
IH
OH
IL
LI
OL
(RB)
IH
IL
Operating current
DC characteristics, 1.8 V devices
Operating current
DC characteristics, 3 V devices
V
V
DD
Standby current (CMOS)
DD
Standby current (CMOS)
Output leakage current
Output high voltage level
Standby current (TTL)
Output low voltage level
Output low current (RB)
Output leakage current
Input leakage current
Output high voltage level
Output low voltage level
Output low current (RB)
Input leakage current
supply voltage (erase and
supply voltage (erase and
Input high voltage
Input low voltage
program lockout)
Input high voltage
Input low voltage
program lockout)
Parameter
Parameter
Sequential
Sequential
Program
Program
Erase
Read
Erase
(1)
read
(1)
(1)
(1)
(1)
(1)
(1)
E = V
V
E = V
V
E = V
V
V
OUT
OUT
Test conditions
Test conditions
IN
t
IN
E = V
I
t
RLRL
E = V
I
OH
RLRL
I
OH
WP = 0/V
I
OL
V
WP = 0/V
= 0 to V
OL
V
= 0 to V
IH
IL,
= 0 to V
OL
IL,
= 0 to V
OL
= –400 µA
, WP = 0/V
= 2.1 mA
= –100 µA
= 100 µA
I
minimum
I
DD
OUT
= 0.4 V
minimum
DD
OUT
= 0.1 V
– 0.2,
– 0.2,
DD
DD
= 0 mA
= 0 mA
DD
DD
DD
DD
max
max
max
max
DD
V
V
0.8V
DD
DD
Min
-0.3
-0.3
Min
2.4
8
3
-
-
-
-
-
-
NAND01G-B2B, NAND02G-B2C
- 0.4
- 0.1
DD
Typ
Typ
10
10
10
10
10
10
8
8
8
4
V
V
0.2V
DD
DD
Max
Max
±10
±10
±10
±10
0.4
0.1
1.1
0.4
1.7
15
15
15
50
20
20
20
50
1
+ 0.3
+ 0.3
DD
Unit
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V
V

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