NAND01GW3B2BZA6E NUMONYX, NAND01GW3B2BZA6E Datasheet - Page 56

no-image

NAND01GW3B2BZA6E

Manufacturer Part Number
NAND01GW3B2BZA6E
Description
IC FLASH 1GBIT 63VFBGA
Manufacturer
NUMONYX
Datasheets

Specifications of NAND01GW3B2BZA6E

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
1G (128M x 8)
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
63-VFBGA
Cell Type
NAND
Density
1Gb
Access Time (max)
25us
Interface Type
Parallel
Boot Type
Not Required
Address Bus
8b
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
128M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Speed
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
NUMONYXST
Quantity:
10 000
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
NAND01GW3B2BZA6E
Manufacturer:
ST
0
Company:
Part Number:
NAND01GW3B2BZA6E
Quantity:
80
Package mechanical
12
Figure 35. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline
1. Drawing is not to scale.
Table 26.
56/61
Symbol
CP
A1
A2
D1
E1
L1
A
B
C
E
α
e
L
Package mechanical
To meet environmental requirements, Numonyx offers these devices in RoHS compliant
packages, which have a lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
RoHS compliant specifications are available at www.numonyx.com.
TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data
D1
DIE
24
1
12.00
20.00
18.40
0.10
1.00
0.22
0.50
0.60
0.80
Typ
millimeters
E1
11.90
19.80
18.30
E
0.05
0.95
0.17
0.10
0.50
Min
12.10
20.20
18.50
Max
1.20
0.15
1.05
0.27
0.21
0.08
0.70
48
25
C
B
e
CP
A2
0.004
0.039
0.009
0.472
0.787
0.724
0.020
0.024
0.031
Typ
A1
NAND01G-B2B, NAND02G-B2C
L1
inches
0.002
0.037
0.007
0.004
0.468
0.779
0.720
0.020
L
Min
TSOP-G
A
0.047
0.006
0.041
0.011
0.008
0.003
0.476
0.795
0.728
0.028
Max

Related parts for NAND01GW3B2BZA6E