MD5832-D256-V3Q18-X-P SanDisk, MD5832-D256-V3Q18-X-P Datasheet - Page 31

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MD5832-D256-V3Q18-X-P

Manufacturer Part Number
MD5832-D256-V3Q18-X-P
Description
IC MDOC P3 256MB 85-FBGA
Manufacturer
SanDisk
Datasheet

Specifications of MD5832-D256-V3Q18-X-P

Format - Memory
FLASH
Memory Type
FLASH - Nand
Memory Size
256M (32M x 8)
Speed
55ns
Interface
Parallel
Voltage - Supply
2.5 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
85-FBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MD5832-D256-V3Q18-X-P
Manufacturer:
SanDisk
Quantity:
10 000
4.
Mobile DiskOnChip P3 enhances performance using various proprietary techniques:
4.1
MultiBurst operation is especially effective for large file reads that are typical during boot-up.
During MultiBurst operation, data is read from the two flash planes in parallel through a 32-bit wide
internal flash interface. Data is read by the host one 16-bit word after another using the CLK input,
resulting in a MultiBurst read mode of up to 80 MB/sec. MultiBurst operation can only be
performed on hosts that support burst reads. See Figure 11 below.
28
Parallel access to the separate 128Mb flash planes, thereby providing an internal 32-bit data
bus. See Section 3.10 for further information.
MultiBurst operation to read large chunks of data, providing a MultiBurst read speed of up to
80 MB/sec.
DMA operation to release the CPU for other tasks in coordination with the platform’s DMA
controller. This is especially useful during the boot stage. Up to 32KB of data can be
transferred during a DMA operation.
Turbo operation to enhance read access time from 55 ns to 33 ns (standard interface, access to
flash addresses).
X
MultiBurst Operation
2 T
ECHNOLOGY
Data Sheet, Rev. 0.3
Mobile DiskOnChip P3
93-SR-009-8L

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