TEA1507P/N1,112 NXP Semiconductors, TEA1507P/N1,112 Datasheet - Page 17

• Manufacturer Part Number: TEA1507P/N1,112
• Description: IC CTRLR SMPS GREEN CM OVP 8DIP
• Manufacturer: NXP Semiconductors
• Series: GreenChip™ IIr

Specifications of TEA1507P/N1,112

• Package / Case: 8-DIP (0.300", 7.62mm)
• Output Isolation: Isolated
• Frequency Range: 6.5 ~ 175kHz
• Voltage - Input: 8.7 ~ 20 V
• Voltage - Output: 650V
• Power (watts): 1W
• Operating Temperature: -20°C ~ 145°C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2336-5; 935267356112; TEA1507PN

Philips Semiconductors
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2000 Dec 05
DBS, DIP, HDIP, SDIP, SIL
GreenChip II SMPS control IC
PACKAGE
suitable
DIPPING
17
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
SOLDERING METHOD
suitable
(1)
Preliminary specification
WAVE
TEA1507
stg(max)
). If the