BUK218-50DC,118 NXP Semiconductors, BUK218-50DC,118 Datasheet - Page 8

• Manufacturer Part Number: BUK218-50DC,118
• Description: TOPFET DUAL SWITCH D2PAK
• Manufacturer: NXP Semiconductors

Specifications of BUK218-50DC,118

• Configuration: High-Side
• Delay Time: 30µs
• Current - Peak: 8A
• Voltage - Supply: 6 V ~ 35 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: D²Pak, TO-263 (6 leads + tab)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Outputs: -
• Input Type: -
• Number Of Configurations: -
• High Side Voltage - Max (bootstrap): -
• Other names: 934056877118; BUK218-50DC /T3; BUK218-50DC /T3

Philips Semiconductors
MECHANICAL DATA
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
October 2001
TOPFET dual high side switch
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
Plastic single-ended surface mounted package (Philips version of D
7 leads (one lead cropped)
DIMENSIONS (mm are the original dimensions)
UNIT
mm
Fig.4. SOT427 surface mounting package
OUTLINE
VERSION
SOT427
4.50
4.10
A
H D
1.40
1.27
A 1
D
D 1
0.85
0.60
b
IEC
1
0.64
0.46
c
e
max.
e
11
D
e
E
JEDEC
4
1.60
1.20
D 1
e
REFERENCES
e
10.30
9.70
E
e
0
7
1.27
e
b
scale
EIAJ
2.5
8
1
2.90
2.10
, centre pin connected to mounting base.
L p
5 mm
15.80
14.80
H D
mounting
2.60
2.20
2
Q
-PAK);
base
L p
A 1
Q
PROJECTION
c
EUROPEAN
A
ISSUE DATE
BUK218-50DC
99-06-25
01-04-18
Product specification
SOT427
Rev 2.010