ISL6209CBZ Intersil, ISL6209CBZ Datasheet - Page 4

• Manufacturer Part Number: ISL6209CBZ
• Description: IC MOSFET DRVR SYNC BUCK 8-SOIC
• Manufacturer: Intersil

Specifications of ISL6209CBZ

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Delay Time: 20ns
• Current - Peak: 2A
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 33V
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -10°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Input Voltage (V
BOOT Voltage (V
BOOT To PHASE Voltage (V
PHASE Voltage (Note 1) . . . . . . . . . . . . . . . . . . . GND - 0.3V to 30V
UGATE Voltage . . . . . . . . . . . . . . . . V
LGATE Voltage . . . . . . . . . . . . . . . GND - 0.3V (DC) to VCC + 0.3V
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-40°C to +125°C
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . .-10°C to +100°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage, V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
VCC SUPPLY CURRENT
Bias Supply Current
POR Rising
POR Falling
Hysteresis
BOOTSTRAP DIODE
Forward Voltage
PWM INPUT
Input Current
PWM Three-State Rising Threshold
PWM Three-State Falling Threshold
Three-State Shutdown Hold-off Time
SWITCHING TIME
UGATE Rise Time (Note 5)
LGATE Rise Time (Note 5)
UGATE Fall Time (Note 5)
LGATE Fall Time (Note 5)
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
UGATE Turn-On Propagation Delay
1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND.
2. θ
3. θ
4. For θ
Tech Brief TB379.
JA
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
GND - 2.5V (<20ns Pulse Width, 5μJ) to VCC + 0.3V
PARAMETER
DELAY
V
BOOT-GND
CC
PHASE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10%
, V
PWM
- 5V (<20ns Pulse Width, 10μJ) to V
). . . . . . . . . . . . . . . . . . . . . -0.3V to 33V
BOOT-PHASE
) . . . . . . . . . . . . -0.3V to VCC + 0.3V
GND - 8V (<20ns Pulse Width, 10μJ)
4
Recommended Operating Conditions, Unless Otherwise Noted.
PHASE
) . . . . . . -0.3V to 7V (DC)
- 0.3V (DC) to V
t
t
t
PDHUGATE
-0.3V to 9V (<10ns)
PDLUGATE
SYMBOL
PDLLGATE
t
t
t
t
RUGATE
RLGATE
FUGATE
FLGATE
I
I
PWM
VCC
V
F
PWM pin floating, V
V
V
V
V
V
V
V
V
V
V
V
V
V
DELAY = VCC
BOOT
BOOT
VCC
PWM
PWM
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
ISL6209
= 5V, forward bias current = 2mA
= 5V
= 5V
= 5V, temperature = +25°C
= 5V, 3nF Load
= 5V, 3nF Load
= 5V, 3nF Load
= 5V, 3nF Load
= 5V, No Output Load, DELAY = VCC
= 5V, No Output Load, DELAY = VCC
= 5V, Outputs Unloaded,
= 5V
= 0V
TEST CONDITIONS
Thermal Information
Thermal Resistance (Typical)
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
SOIC Package (Note 2) . . . . . . . . . . . .
QFN Package (Notes 3, 4). . . . . . . . . .
(SOIC - Lead Tips Only)
VCC
= 5V
0.40
MIN
2.2
3.1
10
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP
0.52
-250
500
250
150
3.4
2.9
85
13
13
20
8
8
8
4
-
-
θ
JA
110
(°C/W)
80
MAX
0.60
4.2
1.8
30
-
-
-
-
-
-
-
-
-
-
-
-
-
θ
JC
UNITS
N/A
(°C/W)
15
mV
μA
μA
μA
ns
ns
ns
ns
ns
ns
ns
ns
V
V
V
V
V