NE1619DS,112 NXP Semiconductors, NE1619DS,112 Datasheet - Page 2

• Manufacturer Part Number: NE1619DS,112
• Description: IC TEMP MONITOR 16SSOP
• Manufacturer: NXP Semiconductors

Specifications of NE1619DS,112

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Multiplexer, Register Bank
• Sensor Type: External & Internal
• Sensing Temperature: 0°C ~ 125°C, External Sensor
• Output Type: SMBus™
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: 0°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-4228-5; 935264532112; NE1619DS; NE1619DS

Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging.
Philips Semiconductors
GENERAL DESCRIPTION
The NE1619 is designed for monitoring the temperatures and supply
voltages of microprocessor-based systems by measuring those
parameters and comparing the readings with programmable limits.
The device provides five possible analog inputs, a remote
temperature sensor input and on-board local temperature sensor.
The device also monitors its own power supply and provides digital
inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus
(System Management bus) by which it can be programmed for
operation and data collection. Readings come from conversions of
the on-board A-to-D converter which cycles through all
measurements in sequence in approximately one second when the
conversion is started. The device includes a number of registers to
store data of the device configuration, status, readings and limits.
Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.
ORDERING INFORMATION
T
amb
Type number
NE1619DS
2004 Oct 05
HECETA4 Temperature and voltage monitor
= 0 C to +125 C
Topside mark
NE1619
Package
Name
SSOP16
(QSOP)
Description
plastic shrink small outline package; 16 leads; body width 3.9 mm;
lead pitch 0.635 mm
2
FEATURES
APPLICATIONS
Monitor local and remote temperatures
Temperature accuracy of 2 C for local, and 3 C for remote
channel
Temperature resolution of 1 C
2.8 V to 5.5 V supply range
Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
V
Differential non-linearity of 1LSB
No calibration required
Programmable temperature and voltage limits for alarms
Programmable Reset low state pulse output
SMBus 2-wire serial interface
Small 16-lead SSOP (QSOP) package
Compatible with Intel “Heceta 4” specification and reference
designs utilizing it
ESD protection exceeds 2000 V HBM per JESD22-A114,
250 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101
Latch-up testing is done to JESDEC Standard JESD78 which
exceeds 100 mA
System thermal and hardware monitor
Desktop computers
Notebook computers
Industrial controllers
Telecom equipment
IN
accuracy of 2% of full scale
Product data sheet
NE1619
Version
SOT519-1
CCP,
V
DD