NE1617ADS,112 NXP Semiconductors, NE1617ADS,112 Datasheet - Page 27

• Manufacturer Part Number: NE1617ADS,112
• Description: IC TEMP MONITOR 16SSOP
• Manufacturer: NXP Semiconductors

Specifications of NE1617ADS,112

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Multiplexer, Register Bank
• Sensor Type: External & Internal
• Sensing Temperature: -55°C ~ 125°C, External Sensor
• Output Type: SMBus™
• Output Alarm: Yes
• Output Fan: No
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Temperature Sensor Function: Temp Sensor
• Interface Type: Serial (2-Wire)
• Operating Temperature (min): 0C
• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935268119112; NE1617ADS; NE1617ADS

NXP Semiconductors
19. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.3.7
8.3.8
8.4
8.5
8.6
9
9.1
9.2
9.3
10
11
11.1
12
13
13.1
13.2
13.3
13.4
14
14.1
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Temperature monitor with SMBus serial
interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Application design-in information . . . . . . . . . 13
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 21
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Remote diode selection . . . . . . . . . . . . . . . . . . 5
No calibration is required . . . . . . . . . . . . . . . . . 6
Address logic . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 6
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Low power standby modes . . . . . . . . . . . . . . . . 8
Configuration register . . . . . . . . . . . . . . . . . . . . 8
External and internal temperature registers . . . 8
Conversion rate register . . . . . . . . . . . . . . . . . . 9
Temperature limit registers . . . . . . . . . . . . . . . . 9
One-shot command . . . . . . . . . . . . . . . . . . . . 10
Status register. . . . . . . . . . . . . . . . . . . . . . . . . 10
Alert interrupt . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power-up default condition . . . . . . . . . . . . . . . 11
Fault detection . . . . . . . . . . . . . . . . . . . . . . . . 11
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 12
How do D+, D- work? . . . . . . . . . . . . . . . . . . . 13
What is the difference using diode
and transistor? . . . . . . . . . . . . . . . . . . . . . . . . 13
How is error reduced when necessary to
use a wire instead of the PCB trace? . . . . . . . 13
Typical performance curves . . . . . . . . . . . . . . 18
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Printed-circuit board layout consideration. . . . 23
15
16
17
17.1
17.2
17.3
17.4
18
19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Temperature monitor for microprocessor systems
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history . . . . . . . . . . . . . . . . . . . . . . . 25
Legal information . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Document identifier: NE1617A_4
NE1617A
Date of release: 30 July 2009
All rights reserved.