GNM212R61A225MA01D Murata Electronics North America, GNM212R61A225MA01D Datasheet - Page 90

• Manufacturer Part Number: GNM212R61A225MA01D
• Description: CAP 2-ARRAY 2.2UF 10V X5R 0805
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM212R61A225MA01D

• Capacitance: 2.2µF
• Voltage - Rated: 10V
• Dielectric Material: Ceramic
• Number Of Capacitors: 2
• Circuit Type: Isolated
• Temperature Coefficient: X5R
• Tolerance: ±20%
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Height: 0.033" (0.85mm)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: GNM212R61A225MA01

13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
(1) Notice for Pattern Forms
Pattern Forms
88
Notice
Prohibited
Correct
Notice (Soldering and Mounting)
Unlike leaded components, chip components are
susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal
stresses than leaded components.
Excess solder fillet height can multiply these stresses and
cause chip cracking. When designing substrates, take
land patterns and dimensions into consideration to
eliminate the possibility of excess solder fillet height.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Placing Close to Chassis
Solder
Resist
Electrode Pattern
Solder (ground)
Chassis
Placing of Chip Components
and Leaded Components
Solder Resist
Lead Wire
Placing of Leaded Components
after Chip Component
Solder Resist
Soldering Iron
Lead Wire
Continued on the following page.
Lateral Mounting
Solder Resist
C02E.pdf
07.2.6