GNM212R61A225MA01D Murata Electronics North America, GNM212R61A225MA01D Datasheet - Page 92

• Manufacturer Part Number: GNM212R61A225MA01D
• Description: CAP 2-ARRAY 2.2UF 10V X5R 0805
• Manufacturer: Murata Electronics North America
• Series: GNMr

Specifications of GNM212R61A225MA01D

• Capacitance: 2.2µF
• Voltage - Rated: 10V
• Dielectric Material: Ceramic
• Number Of Capacitors: 2
• Circuit Type: Isolated
• Temperature Coefficient: X5R
• Tolerance: ±20%
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Height: 0.033" (0.85mm)
• Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: GNM212R61A225MA01

13
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Table 4 LLM Series for Reflow Soldering Land Dimensions
2. Adhesive Application
90
Notice
GNMpp2
LLM
GNM, LLA Series for Reflow Soldering Method
LLM Series for Reflow Soldering Method
Thin or insufficient adhesive causes chips to loosen or
Low viscosity adhesive causes chips to slip after
become disconnected when flow soldered. The amount
of adhesive must be more than dimension c shown in the
drawing at right to obtain enough bonding strength.
The chip's electrode thickness and land thickness must
be taken into consideration.
mounting. Adhesive must have a viscosity of 5000Pa
(500ps) min. (at 25D)
Adhesive Coverage*
Continued from the preceding page.
GRM18, GQM18
GRM21, LLL21, GQM21
GRM31, LLL31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
Part Number
Part Number
GNM1M2
GNM212
GNM214
GNM314
e
LLA18
LLA21
LLA31
LLM21
LLM31
a
Chip Capacitor
c
p
Chip Capacitor
p
d
f
0.6 to 0.8
Adhesive Coverage*
Land
1.0
c
1.37
a
2.0
2.0
3.2
1.6
2.0
3.2
L
0.05mg min.
0.15mg min.
0.1mg min.
b'
a
b
b
b=(c-e)/2, b'=(d-f)/2
c'
*Nominal Value
(0.3 to 0.5)
(0.3 to 0.5)
b, b'
1.25
1.25
1.25
1.0
1.6
0.8
1.6
W
•
s
c, c'
0.3
0.4
0.4 to 0.5
0.6 to 0.7
0.6 to 0.7
0.8 to 1.0
0.3 to 0.4
0.7 to 0.8
0.8 to 1.0
GNMpp4
LLA
a
Dimensions (mm)
Dimensions (mm)
2.0 to 2.6
3.2 to 3.6
Board
d
0.35 to 0.45
0.25 to 0.4
0.5 to 0.7
0.5 to 0.7
0.7 to 0.9
0.4 to 0.6
0.7 to 0.9
b
c
1.3 to 1.8
1.6 to 2.0
Chip Capacitor
Chip Capacitor
e
Land
p
Adhesive
0.25 to 0.35
0.3 to 0.35
0.2 to 0.28
0.4 to 0.5
0.3 to 0.4
0.2 to 0.3
0.3 to 0.4
Continued on the following page.
1.4 to 1.6
c
Land
2.6
f
a : 20 to 70 m
b : 30 to 35 m
c : 50 to 105 m
a
b
a
b
0.64
c
1.0
0.5
0.8
0.4
0.5
0.8
p
0.5
0.8
p
C02E.pdf
07.2.6