L5981 STMicroelectronics, L5981 Datasheet - Page 26

IC REG SW STEP DOWN 1A 8-VFQFPN

L5981

Manufacturer Part Number
L5981
Description
IC REG SW STEP DOWN 1A 8-VFQFPN
Manufacturer
STMicroelectronics
Type
Step-Down (Buck)r
Datasheet

Specifications of L5981

Internal Switch(s)
Yes
Synchronous Rectifier
No
Number Of Outputs
1
Voltage - Output
0.6 ~ 18 V
Current - Output
1A
Frequency - Switching
250kHz ~ 1MHz
Voltage - Input
2.9 ~ 18 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-VFQFN, 8-VFQFPN
Power - Output
1.5W
Output Voltage
3 V
Output Current
1 A
Input Voltage
2.9 V to 18 V
Switching Frequency
220 KHz to 275 KHz
Operating Temperature Range
- 40 C to + 150 C
Mounting Style
SMD/SMT
Duty Cycle (max)
100 %
Low Dropout Operation
100 % duty cycle
For Use With
497-6385 - BOARD EVAL FOR L5981
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
L5981
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
L5981TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
L5981TR
Manufacturer:
STM
Quantity:
2
Application information
5.5
26/37
Thermal considerations
The thermal design is important to prevent the thermal shutdown of device if junction
temperature goes above 150 °C. The three different sources of losses within the device are:
Equation 26
Where D is the duty cycle of the application and the maximum R
the duty cycle is theoretically given by the ratio between V
higher to compensate the losses of the regulator. So the conduction losses increases
compared with the ideal case.
Equation 27
Where T
and the current flowing into it during turn ON and turn OFF phases, as shown in
T
switching time is 50 ns.
Equation 28
where I
The junction temperature T
Equation 29
Where T
Rth
calculated as the parallel of many paths of heat conduction from the junction to the ambient.
For this device the path through the exposed pad is the one conducting the largest amount
SW
JA
a)
b)
c)
is the equivalent switching time. For this device the typical value for the equivalent
is the equivalent thermal resistance junction to ambient of the device; it can be
Q
A
RISE
is the quiescent current (I
conduction losses due to the not negligible R
equal to:
switching losses due to power MOSFET turn ON and OFF; these can be
calculated as:
Quiescent current losses, calculated as:
is the ambient temperature and P
and T
P
SW
FALL
=
V
IN
are the overlap times of the voltage across the power switch (V
I
J
OUT
can be calculated as:
Doc ID 13004 Rev 6
P
(
------------------------------------------ - Fsw
T
ON
T
Q
RISE
J
= 2.4 mA).
=
=
P
+
2
R
T
Q
T
DS on
A
FALL
+
=
TOT
(
Rth
V
)
IN
)
is the sum of the power losses just seen.
JA
(
I
I
OUT
Q
P
TOT
)
=
DS(on)
2
V
D
IN
OUT
of the power switch; these are
I
OUT
an V
DSON
T
IN
SW
, but actually it is quite
is 220 mΩ. Note that
F
SW
Figure
L5981
DS
16.
)

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