DS34T108GN+ Maxim Integrated Products, DS34T108GN+ Datasheet - Page 6

• Manufacturer Part Number: DS34T108GN+
• Description: IC TDM OVER PACKET 484HSBGA
• Manufacturer: Maxim Integrated Products
• Type: TDM (Time Division Multiplexing)r

Specifications of DS34T108GN+

• Applications: Data Transport
• Mounting Type: Surface Mount
• Package / Case: 484-BGA Exposed Pad, 484-eBGA, 484-HBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABRIDGED DATA SHEET
____________________________________________________ DS34T101, DS34T102, DS34T104, DS34T108
Figure 3-2. TDMoP in Cellular Backhaul
Other Possible Applications
Point-to-Multipoint TDM Connectivity over IP/Ethernet
The DS34T10x devices support NxDS0 TDMoP connections (known as bundles) with or without CAS (Channel
Associated Signaling). There is no need for an external TDM cross-connect, since the packet domain can be used
as a virtual cross-connect. Any bundle of timeslots can be directed to another remote location on the packet
domain.
HDLC Transport over IP/MPLS
TDM traffic streams often contain HDLC-based control channels and data traffic. These data streams, when
transported over a packet domain, should be treated differently than the time-sensitive TDM payload. DS34T10x
devices can terminate HDLC channels in the TDM streams and optionally map them into IP/MPLS/Ethernet for
transport. All HDLC-based control protocols (ISDN BRI and PRI, SS7 etc.) and all HDLC data traffic can be
managed and transported.
Using a Packet Backplane for Multiservice Concentrators
A communications device with all the above-mentioned capabilities can use a packet-based backplane instead of
the more expensive TDM bus option. This enables a cost-effective and future-proof design of communication
platforms with full support for both legacy and next-generation services.
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