IDT89HPES16T4G2ZABXG8 IDT, Integrated Device Technology Inc, IDT89HPES16T4G2ZABXG8 Datasheet - Page 15

• Manufacturer Part Number: IDT89HPES16T4G2ZABXG8
• Description: IC PCI SW 16LANE 4PORT 288-SBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES16T4G2ZABXG8

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 89HPES16T4G2ZABXG8

Thermal Considerations
Power Consumption
(and also listed below).
Table 13 (and also listed below).
that is relevant to the thermal performance of the PES16T4G2 switch.
IDT 89HPES16T4G2 Data Sheet
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
This section describes thermal considerations for the PES16T4G2 (23mm
Number of active
(Full swing)
(Full swing)
Lanes per Port
4/4/4/4
4/4/1/1
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 17), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JC
JB
θ
JA
= (T
Watts
Watts
mA
mA
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
1.0V
Core Supply
- T
Typ
0.65
650
500
0.5
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Power Dissipation of the Device
Table 17 Thermal Specifications for PES16T4G2, 23x23 mm SBGA288 Package
)/P
1.1V
Max
Junction Temperature
Ambient Temperature
0.73
, T
908
660
1.0
Parameter
A(max)
, and P are known, the value of desired
1.0V
PCIe Analog
Typ
0.65
0.44
650
440
Supply
Table 16 PES16T4G2 Power Consumption
1.1V
Max
0.85
0.61
770
550
15 of 31
2.5V
PCIe Analog
High Supply
Typ
0.65
0.38
260
150
θ
2
CS
Value
2.75V
SBGA288 package). The data in Table 17 below contains information
19.8
13.3
11.8
3.24
Max
125
), that of the heat sink (
9.5
1.1
0.91
0.61
70
330
220
θ
1.0V
Typ
PCIe Termin-
0.36
0.16
JA
ation Supply
361
160
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
o
o
C
C
θ
1.1V
Max
JA
0.47
0.18
429
165
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
3.3V
Typ
0.01
0.01
I/O Supply
3
3
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
Maximum
3.465V
Max
0.02
0.02
4
4
September 13, 2010
Power
Typ
2.32
1.48
J(max)
θ
Total
JC
(value
value
Power
Max
3.24
2.13