IDT89HPES24T3G2ZBALG8 IDT, Integrated Device Technology Inc, IDT89HPES24T3G2ZBALG8 Datasheet - Page 16

• Manufacturer Part Number: IDT89HPES24T3G2ZBALG8
• Description: IC PCI SW 24LANE 3PORT 324-FCBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES24T3G2ZBALG8

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 89HPES24T3G2ZBALG8

Thermal Considerations — Option A Package
Thermal Considerations — Option B Package
that is relevant to the thermal performance of the PES24T3G2 switch.
that is relevant to the thermal performance of the PES24T3G2 switch.
IDT 89HPES24T3G2 Data Sheet
This section describes thermal considerations for the PES24T3G2 (19mm
This section describes thermal considerations for the PES24T3G2 (27mm
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 17), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
θ
Symbol
Symbol
JA(effective)
JA(effective)
T
T
T
T
A(max)
A(max)
J(max)
θ
J(max)
θ
θ
θ
P
P
JC
JC
JB
JB
θ
JA
= (T
J(max)
Effective Thermal Resistance, Junction-to-Ambient
Effective Thermal Resistance, Junction-to-Ambient
θ
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Table 17 Thermal Specifications for PES24T3G2, 19x19 mm FCBGA324 Package
Table 18 Thermal Specifications for PES24T3G2, 27x27 mm FCBGA676 Package
Power Dissipation of the Device
Power Dissipation of the Device
)/P
Junction Temperature
Ambient Temperature
Junction Temperature
Ambient Temperature
, T
Parameter
Parameter
A(max)
, and P are known, the value of desired
16 of 48
θ
2
2
CS
Value
Value
FCBGA324 package). The data in Table 17 below contains information
FCBGA676 package). The data in Table 18 below contains information
16.8
10.1
4.31
14.6
4.31
125
125
), that of the heat sink (
9.2
4.1
0.3
8.2
7.2
3.1
0.3
70
70
θ
JA
Units
Units
becomes a known entity to the system designer. How to
Watts
Watts
o
o
o
o
o
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
o
o
o
o
C
C
C
C
θ
JA
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
Conditions
Conditions
1 m/S air flow
2 m/S air flow
1 m/S air flow
2 m/S air flow
Zero air flow
Zero air flow
Maximum
Maximum
Maximum
Maximum
Maximum
Maximum
September 29, 2010
J(max)
θ
JC
(value
value