IDT89HPES48T12ZABR IDT, Integrated Device Technology Inc, IDT89HPES48T12ZABR Datasheet - Page 19

• Manufacturer Part Number: IDT89HPES48T12ZABR
• Description: IC PCI SW 48LANE 12PORT 1156BGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES48T12ZABR

• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Operating Temperature (max): 70C
• Package Type: FCBGA
• Rad Hardened: No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 89HPES48T12ZABR

IDT 89HPES48T12 Data Sheet
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
value
J(max)
θ
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
) for the worst case scenario must be
JA
maintained below the value determined by the formula:
θ
= (T
- T
)/P
JA
J(max)
A(max)
θ
Given that the values of T
, T
, and P are known, the value of desired
becomes a known entity to the system designer. How to
J(max)
A(max)
JA
θ
achieve the desired
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
(value
θ
JA
JC
θ
θ
provided in Table 16), thermal resistance of the chosen adhesive (
), that of the heat sink (
), amount of airflow, and properties of the
CS
SA
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 10 or
more layers AND the board size is larger than 4"x12" AND airflow in excess of 1 m/s is available. It is strongly recommended that users
perform their own thermal analysis for their own board and system design scenarios.
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October 7, 2008