TLP705(TP,F) Toshiba, TLP705(TP,F) Datasheet - Page 56

IC PHOTOCOUPLER IRED 6SMD

TLP705(TP,F)

Manufacturer Part Number
TLP705(TP,F)
Description
IC PHOTOCOUPLER IRED 6SMD
Manufacturer
Toshiba
Datasheets

Specifications of TLP705(TP,F)

Voltage - Isolation
5000Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
450mA
Propagation Delay High - Low @ If
105ns @ 10mA ~ 0mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
6-SMD
Number Of Elements
1
Forward Voltage
1.8V
Forward Current
20mA
Isolation Voltage
5000Vrms
Package Type
SDIP
Operating Temp Range
-40C to 100C
Propagation Delay Time
200ns
Pin Count
6
Mounting
Surface Mount
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP705FTR
8
Below are the example land patterns for surface-mount packages.
Surface-Mount Lead-Formed Photocouplers
Mini-flat and SOP couplers
Example:
1
MFSOP6 (4-Pin) [e.g., TLP181]
(LF1)&(LF5) [e.g., TLP734(LF1)]
SO6 (4-Pin) [e.g., TLP265J]
2.54SOP4 [e.g., TLP197G]
Board Assembly
For the example land patterns for the TLP781, see its datasheet.
Example Land Patterns
1.5
6-pin DIP package
0.8
2.54
2.54
2.54
SO8 [e.g., TLP2105]
1.27
1.27
MFSOP6 (5-Pin) [e.g., TLP114A]
(LF4) [e.g., TLP734(LF4)]
1.5
1.27
0.8
2.54
0.8
1.27
2.54
1.27
2.54
Unit: mm
56
SOP4 [e.g., TLP280]
Example:
0.8
1.27
SDIP6 [e.g., TLP719]
6-pin SDIP package
0.8
1.27 1.27
SO6 (5-Pin) [e.g., TLP109]
1.27
2.54
SSOP4 [e.g., TLP3213]
1.27
SDIP6 (F type) [e.g., TLP719F]
0.8
3.73
0.8
1.27 1.27
0.95
Unit: mm
Unit: mm

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