PS9711 NEC, PS9711 Datasheet - Page 7

OPT CPL HI SPD DIGITL HI CMR SMT

PS9711

Manufacturer Part Number
PS9711
Description
OPT CPL HI SPD DIGITL HI CMR SMT
Manufacturer
NEC
Datasheet

Specifications of PS9711

Voltage - Isolation
2500Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
13mA
Data Rate
10Mbps
Propagation Delay High - Low @ If
30ns @ 7.5mA
Current - Dc Forward (if)
30mA
Input Type
DC
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Package / Case
5-SOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PS9711
Manufacturer:
NEC
Quantity:
20 000
Part Number:
PS9711-F3
Manufacturer:
MAXIM
Quantity:
6 713
PS9711
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 ˚C
• Number of reflows
• Flux
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected
to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
CEL for all damages resulting from such improper use or sale.
RECOMMENDED SOLDERING CONDITIONS
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
(3) Cautions
• Fluxes
100 to 160 ˚C
260 ˚C or below (molten solder temperature)
10 seconds or less
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is recommended).
Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
(preheating)
60 to 120 s
235 ˚C or below (package surface temperature)
30 seconds or less
Three
Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt % is
recommended).
Time (s)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
210 ˚C
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
03/17/2003

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