TLP620(F,T) Toshiba, TLP620(F,T) Datasheet - Page 25

PHOTOCPLR AC IN TRANS-OUT 4-DIP

TLP620(F,T)

Manufacturer Part Number
TLP620(F,T)
Description
PHOTOCPLR AC IN TRANS-OUT 4-DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP620(F,T)

Number Of Channels
1
Input Type
AC, DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ ±5mA
Current Transfer Ratio (max)
600% @ ±5mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
60mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP (0.300", 7.62mm)
Output Device
Transistor
Number Of Elements
1
Forward Voltage
1.3V
Forward Current
60mA
Collector-emitter Voltage
55V
Package Type
PDIP
Collector Current (dc) (max)
50mA
Isolation Voltage
5000Vrms
Power Dissipation
250mW
Current Transfer Ratio
600%
Pin Count
4
Mounting
Through Hole
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Maximum Collector Emitter Voltage
55 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Maximum Fall Time
3 us
Maximum Input Diode Current
60 mA
Maximum Rise Time
2 us
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP620F
*Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative.
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
Photocouplers for IGBT/MOSFET Gate Drive (Continued)
TLP557
TLP700
TLP700F
TLP700H*
TLP700HF*
TLP701
TLP701F
TLP701A*
TLP701AF*
TLP701H*
TLP701HF*
TLP705
TLP705F
TLP705A*
TLP705AF*
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
8
1
6
1
6
1
6
1
6
1
6
1
6
1
6
1
7
2
5
5
5
5
5
5
5
2
2
2
2
2
2
2
: Design which meets safety standard/approval pending as of January 2011
6
3
4
3
4
3
4
3
4
3
4
3
4
3
4
3
5
4
DIP8
Direct drive of a power
transistor
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
SDIP6
T
Direct drive of a
medium-power
IGBT/MOSFET
High CMR
SDIP6
Direct drive of a
medium-power
IGBT/MOSFET
Low power dissipation
SDIP6
T
Direct drive of a
small-power
IGBT/MOSFET
High CMR
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed (250 kHz)
Low power dissipation
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
Low power dissipation
SDIP6
Direct drive of a
small-power
IGBT/MOSFET
High speed
Low power dissipation
opr
opr
= 125°C (max)
= 125°C (max)
Features
: Approved (reinforced insulation)
Delay Time (Max)
Propagation
0.5 μs
0.7 μs
0.7 μs
0.5 μs
0.7 μs
0.2 μs
0.2 μs
5 μs
25
Constant current
output : 0.25 A
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
current (max):
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
Peak output
±0.45 A
Output
±2.0 A
±2.0 A
±0.6 A
±0.6 A
±0.6 A
±0.6 A
: Design which meets safety standard/approval pending as of January 2011
7.5 mA
(Max)
5 mA
5 mA
5 mA
5 mA
5 mA
5 mA
8 mA
I
FHL
2500
Vrms
Vrms
5000
Vrms
Vrms
Vrms
5000
Vrms
Vrms
Vrms
5000
5000
5000
5000
5000
BVs
UL/cUL TÜV
/
/
/
/
/
/
/
/
Safety Standards
VDE
BSI
(2)
IEC

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