TLP620(F,T) Toshiba, TLP620(F,T) Datasheet - Page 42

PHOTOCPLR AC IN TRANS-OUT 4-DIP

TLP620(F,T)

Manufacturer Part Number
TLP620(F,T)
Description
PHOTOCPLR AC IN TRANS-OUT 4-DIP
Manufacturer
Toshiba
Datasheets

Specifications of TLP620(F,T)

Number Of Channels
1
Input Type
AC, DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ ±5mA
Current Transfer Ratio (max)
600% @ ±5mA
Voltage - Output
55V
Current - Output / Channel
50mA
Current - Dc Forward (if)
60mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP (0.300", 7.62mm)
Output Device
Transistor
Number Of Elements
1
Forward Voltage
1.3V
Forward Current
60mA
Collector-emitter Voltage
55V
Package Type
PDIP
Collector Current (dc) (max)
50mA
Isolation Voltage
5000Vrms
Power Dissipation
250mW
Current Transfer Ratio
600%
Pin Count
4
Mounting
Through Hole
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Maximum Collector Emitter Voltage
55 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
50 mA
Maximum Power Dissipation
250 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Maximum Fall Time
3 us
Maximum Input Diode Current
60 mA
Maximum Rise Time
2 us
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP620F
6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
4
(TP4)
(LF4)
9
8
Min
8.0
(0.25 typ.)
B
(LF4)
Max
12.0
Min
6.4
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16

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