TLP126(F) Toshiba, TLP126(F) Datasheet - Page 2

• Manufacturer Part Number: TLP126(F)
• Description: PHOTOCPLR AC-IN TRANS-OUT 4-SMD
• Manufacturer: Toshiba

Specifications of TLP126(F)

• Number Of Channels: 1
• Input Type: AC, DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 100% @ 1mA
• Current Transfer Ratio (max): 1200% @ 1mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Configuration: 1
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 400 mV
• Isolation Voltage: 3750 Vrms
• Current Transfer Ratio: 1200 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 75 C
• Minimum Operating Temperature: - 25 C
• Maximum Input Diode Current: 50 mA
• Output Device: Transistor
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 1.6mA
• Output Voltage: 80V
• Opto Case Style: Mini-Flat
• No. Of Pins: 4
• Approval Bodies: UL
• Rohs Compliant: Yes
• Number Of Elements: 1
• Forward Voltage: 1.3V
• Forward Current: 50mA
• Collector-emitter Voltage: 80V
• Package Type: MFSOP
• Collector Current (dc) (max): 50mA
• Power Dissipation: 200mW
• Collector-emitter Saturation Voltage: 0.4V
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -25C to 75C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP126F

As a type of isolator favored by manufacturers, photocouplers
now serve as noise protectors in many electronic devices.
Toshiba’s photocouplers consist of either a GaAs or GaA As
infrared LED(s) and a silicon photodetector(s) housed in a mold
package. GaA As LEDs are adopted in high-speed photo-IC
types due to their high-speed and high-light output.
C O N T E N T S
1. Product Index ............................................................... 3
2. New Products .............................................................. 5
3. Photocoupler Product Tree .......................................... 9
4. Selection Guide ......................................................... 10
5. Part Naming Conventions .......................................... 41
Preface
1
2. Photocouplers for Logic Signal Transmission
3. Photocouplers for IGBT/MOSFET Gate Drive
4. Photorelays (1-Form-A and 2-Form-A)
5. Photorelays
6. Triac-Output Photocouplers
7. Thyristor-Output Photocouplers
8. Photovoltaic-Output photocouplers
9. Products Manufactured by Toshiba Semiconductor
.
(1-Form-B, 2-Form-B and 1-Form-A/1-Form-B)
Transistor-Output and Darlington-Transistor-
Output Photocouplers
(Thailand) Co., Ltd. (TST)
Perspective view
of the TLP521-1
............................................... 10
......................................... 38
...................................... 34
of the TLP521-1
Cross section
................................ 37
.......................... 38
.................... 26
.......... 17
........ 23
...... 32
White overmold
(epoxy)
Detector
Dome (silicon)
Infrared LED
Lead frame
6. Package Information .................................................. 42
7. Packing Information ................................................... 50
8. Board Assembly ......................................................... 56
9. Device Degradation ................................................... 58
10. Safety Standard Approvals ...................................... 65
11. Photocoupler Application Circuit Examples ............. 67
12. Competitor Cross Reference ................................... 79
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3
1
2
1
2
1
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Lead Form Options for DIP Packages
Package Dimensions
Rank Marking .........................................................
Photocoupler Magazine Packing
Tape-and-Reel Specifications
Example Land Patterns ..........................................
Board Assembly Considerations
Projected Operating Life Based on LED Light
Specifications
Output Degradation
2
To meet customers’ various needs, we offer an extensive
product portfolio shown below as well as general-
purpose photocouplers.
UL approval has been obtained under file number E67349 for
most of our photocouplers. EN60747-5-2-approved
photocouplers are also offered with a wide selection of output
(transistor, thyristor, triac, IC output and photorelay). The
designs of these devices meet other standards including
IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065.
Toshiba offers a wide variety of photocouplers in a small
package to meet the space-saving requirement of increasingly
smaller and thinner end products. Packaging options include
mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat
SOP packages.
Part of the general-purpose photocouplers with transistor and
triac outputs are manufactured by Toshiba Semiconductor
Thailand Co., Ltd. This will help customers procure components
locally for overseas assembly of end products.
Extensive Line of Products
Safety Standard Approvals
Small-Package Products
Overseas Manufactured Photocouplers
1. Photo-IC couplers: High speed and advanced functions
2. Zero-crossing phototriac couplers: Phototriac-output
3. Photovoltaic couplers: MOSFET gate drive (high voltage
4. Photorelays (MOSFET-output devices):
(highly integrated detectors)
devices with zero-crossing detection
output achieved using a photodiode array)
............................................................. 51
AC-DC switches (MOSFET output)
Mechanical relay replacement
................................................... 58
................................................. 43
................................... 53
.............................. 57
..................... 42
49
56